A multi-layer ceramic electronic component includes: a ceramic body including first and second internal electrodes laminated in a first axis direction, first and second main surfaces facing in the first axis direction, and first and second end surfaces facing in a second axis direction orthogonal to the first axis, the first and second internal electrodes being drawn to those end surfaces; a first external electrode covering the first end surface and extending to the first main surface; and a second external electrode covering the second end surface and extending to the first main surface. Each external electrode includes a first region including a first outermost layer mainly containing tin and extending from the end surface to the first main surface, and a second region free from an outermost layer mainly containing tin and disposed adjacent to the first region in the first axis direction on the end surface.

A gimbal and a method for winding a flexible cable on a gimbal are provided. The gimbal includes a first motor and a second motor connected with each other. The flexible cable includes a connection unit and a connection end connected with each other, and the connection end is extended from the connection unit. The gimbal winding method includes winding the connection unit on the first motor while allowing the connection end to be electrically connected with the second motor.

An arrangement of individually addressable nanostructures (200) in an array format on a substrate (100) (non-conducting, flexible or rigid) with electrical portions (conducing) in the substrate where the electrical portions form electrical contacts with the nanostructures is utilized to form individually addressable nanostructures. The said nanostructures can be 1-1 000 000 nm in base size and range from 1-1000 000 nm in height. The distance between the said nanostructures in the array can also range from 10-1 000 000 nm. The said nanostructures are covered in a dielectric material (300) (air, polymer, ceramic) that is at least 5-5 00 000 nm thicker than the height of the said nanostructures. The dielectric properties of the dielectric material are an important component in determining the capacitance/supercapacitance properties of the fingerprint device. A top electrode (400) is placed on the face of dielectric film opposite to the face in contact with the substrate where nanostructures are arranged. A top layer (500) (glass or Other robust material) is placed on top of the top metal electrode. A voltage V (900) is applied between the nanostructures (200) and the top electrodes (400), an intense electric field (600) is generated between the nanostructures (200) and the top electrode (400). The direction of the said electrical field is dependent on the polarity of the voltage applied. The electric capacitance (700) between the nanostructures and the top electrode as formed. When a finger (1000) is placed on the device, the ridges (1001) of the fingerprints make contact with the top layer (500) of the device causing a signal, (a change in the capacitance of the device) that can be detected using external circuits. The valleys (1002) of the finger do not make contact with the top layer (500) device and hence do not produce a signal. If a pressure is applied on the top layer (500), the distance between the top electrode (400) and the nanostructures (200) is reduced, causing a change in the capacitance, allowing measurement of pressure. Since the nanostructures (200) are distributed on a surface (2000) in sections (2010) we can obtain special resolution of pressure on a surface or gather fingerprints using a cost effective, low power, robust and stand-alone portable, miniature system.

A multi-layer ceramic electronic component includes: a ceramic body including first and second internal electrodes laminated in a first axis direction, first and second main surfaces facing in the first axis direction, and first and second end surfaces facing in a second axis direction orthogonal to the first axis, the first and second internal electrodes being drawn to those end surfaces; a first external electrode covering the first end surface and extending to the first main surface; and a second external electrode covering the second end surface and extending to the first main surface. Each external electrode includes a first region including a first outermost layer mainly containing tin and extending from the end surface to the first main surface, and a second region free from an outermost layer mainly containing tin and disposed adjacent to the first region in the first axis direction on the end surface.

A multilayer flexible electronics platform is an apparatus that allows modular thin-film electronics to be integrated into everyday flexible, flat objects such as pieces of clothing, material coatings, or wearable devices. The apparatus includes a flexible water-impermeable envelop, a flexible power-source layer, a flexible printed circuit board (PCB) layer, and a flexible accessory-interfacing layer. The flexible accessory-interfacing layer allows those modular thin-film electronics to be electronically and electrically attached to the apparatus. The flexible PCB layer allows the apparatus to control and manage those modular thin-film electronics. The flexible power-source layer is used to provide electrical power to those modular thin-film electronics. The flexible water-impermeable envelop protectively encloses those modular thin-film electronics and the aforementioned functional layers of the apparatus.

Surface treatment methods for improving electromagnetic interaction characteristics and related assemblies. In some embodiments, a vehicle RADAR assembly may comprise a RADAR module, a housing, and a surface having a plurality of parallel grooves defining a plurality of pointed projections. The plurality of grooves may be configured to decrease the reflectivity of electromagnetic radiation from the RADAR module relative to the housing and/or to de-cohere reflected radiation. In some embodiments, the grooves may be specifically sized and/or shaped to improve upon the RADAR signal interaction characteristics of the housing or other element having the surface.

A power tool and a printed circuit board assembly (PCBA) for the power tool. The PCBA includes, for example, a printed circuit board (PCB), a heat sink, a spacer between the PCB and the heat sink, and a gap pad. The PCB and the heat sink are fastened to one another via fasteners so the spacer absorbs excess forces torsional forces from torques applied to the fasteners. The gap pad is placed within an opening or recess of the spacer to contact one or more FETs on the PCB. In some embodiments, the PCBA includes a second heat sink or rigid member on the opposite side of the PCB than the spacer to further distribute excess torsional forces from torques applied to the fasteners.

A shield is provided, including a frame and a cover. The frame includes a plurality of frame side walls and a frame top structure. Each frame side wall includes at least one frame side wall wedge. The frame side walls are connected to the frame top structure, and the frame top structure includes at least one cantilever beam. The cover includes a plurality of cover side walls and a cover top structure. Each cover side wall includes at least one cover side wall opening. The frame side wall wedge is adapted to be wedged into the cover side wall opening to restrict the movement of the cover in a first direction. The cover side walls are connected to the cover top structure. The cover top structure includes at least one cover top opening. The cantilever beam is wedged into and abuts the cover top opening.

A multilayer flexible electronics platform is an apparatus that allows modular thin-film electronics to be integrated into everyday flexible, flat objects such as pieces of clothing, material coatings, or wearable devices. The apparatus includes a flexible water-impermeable envelop, a flexible power-source layer, a flexible printed circuit board (PCB) layer, and a flexible accessory-interfacing layer. The flexible accessory-interfacing layer allows those modular thin-film electronics to be electronically and electrically attached to the apparatus. The flexible PCB layer allows the apparatus to control and manage those modular thin-film electronics. The flexible power-source layer is used to provide electrical power to those modular thin-film electronics. The flexible water-impermeable envelop protectively encloses those modular thin-film electronics and the aforementioned functional layers of the apparatus.

A power tool and a printed circuit board assembly (PCBA) for the power tool. The PCBA includes, for example, a printed circuit board (PCB), a heat sink, a spacer between the PCB and the heat sink, and a gap pad. The PCB and the heat sink are fastened to one another via fasteners so the spacer absorbs excess forces torsional forces from torques applied to the fasteners. The gap pad is placed within an opening or recess of the spacer to contact one or more FETs on the PCB. In some embodiments, the PCBA includes a second heat sink or rigid member on the opposite side of the PCB than the spacer to further distribute excess torsional forces from torques applied to the fasteners.