A multilayer circuit board includes an upper surface and an opposing lower surface. An electrically insulating layer is disposed between the upper and lower surfaces. A plurality of electrically conductive upper and lower rear pads are disposed proximate a rear edge on the respective upper and lower surfaces for termination of a plurality of wires. The upper and lower rear pads include respective upper and lower rear ground pads substantially aligned with each other and configured for termination of ground wires. A plurality of electrically conductive front pads are disposed proximate a front edge for insertion into a connector and electrically connected to the upper and lower rear pads. An electrically conductive via extends from the upper rear ground pad to the lower rear ground pad and makes electrical and physical contact with each of the upper and lower rear ground pads.

An electric module with a planar transformer has a housing with an interior having an internal length and an internal height. The electric module additionally has a main printed circuit board with a first thickness, the main printed circuit board being equipped with at least one electronic component. The planar transformer is arranged on an additional printed circuit board with a second thickness, and the main printed circuit board has a recess which receives the additional printed circuit board. Additionally, the main printed circuit board and the additional printed circuit board are connected together via a connection.

A circuit board includes a protective film of such a type that a mating contact slides on the protective film and rides over a pad, and is prevented from deteriorating due to attachment and detachment. A circuit board 10 includes a plate-shaped base body 40, a pad 20 formed on a surface of the base body 40 and responsible for electrical contact with a mating contact, and a protective film 30 that spreads on the surface of the base body 40 in contact with an edge of the pad 20. The edge of the pad 20 and a portion, which contacts the edge of the pad 20, of the protective film 30 respectively have heights consecutive to each other. The pad 20 contacts, by causing the mating contact that has slid in a sliding direction in contact with the protective film 30 to ride over the pad 20, the mating contact that has ridden over the pad 20.

Embodiments described herein relate to a system for positioning indicator lights of a network device. The system may include a circuit board, which may include a circuit board edge positioned behind a front panel of the network device, two surfaces; and a side of the circuit board edge positioned between the two surfaces. The system may also include a hole through the circuit board near the circuit board edge, a cutout extending from a portion of the hole to the side of the circuit board edge, a LED coupled to the surface of the circuit board and adapted to emit light into the hole, and a lightpipe disposed in the hole to receive light emitted from the LED into a first end of the lightpipe. The lightpipe may direct the light from a second end of the lightpipe toward an opening in the front panel of the network device.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.

A display device includes a base film including a first region and a plurality of second regions having the first region therebetween; an inorganic insulating film on the base film, the inorganic insulating film being in contact with the plurality of second regions of the base film; a plurality of first pixels overlapping the first region; and a plurality of second pixels overlapping the plurality of second regions with the inorganic insulating film being between the plurality of second pixels and the plurality of second regions. The inorganic insulating film is divided by the first region and is discontinuous between the plurality of second regions.

A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.

An electronic component module includes a substrate; at least one electronic component mounted on an electronic component mounting surface of the substrate; an insulating body covering the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by sputtering, the metal film covering at least one exterior surface of the insulating body and at least one side surface of the substrate. The substrate has a recess portion formed on a periphery of the surface of the substrate that is opposite to the electronic component mounting surface, and the recess portion has a top surface parallel to the electronic component mounting surface and a side surface perpendicular to the top surface, and the metal film is extended to cover the top surface of the recess portion, without covering the side surface thereof. It obtains improved electromagnetic wave shielding effect and improved manufacturing efficiency.