A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.

A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

A component built-in substrate incorporates a chip capacitor in a multilayer substrate including laminated base material layers made of thermoplastic resin. The chip capacitor includes an uneven portion including a recessed portion and a projected portion on one side in a laminated direction. On one side of the chip capacitor in the multilayer substrate, a density of low fluid member with a melting point higher than a fluidization temperature of the base material layers is higher in a region overlapping the recessed portion of the chip capacitor than in a region overlapping the projected portion of the chip capacitor when viewed in the lamination direction.

An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

Embodiments include herein are directed towards a method for use in an electronic design environment is provided. Embodiments may include receiving a printed circuit board schematic and one or more electronic circuits. Embodiments may further include automatically generating, one or more circuit templates based upon, at least in part, the printed circuit board schematic and one or more electronic circuits. The one or more circuit templates may be stored at an electronic design database. Embodiments may also include receiving a current printed circuit board schematic and automatically determining whether a subcircuit of the current printed circuit board schematic is an exact or approximate match with the one or more circuit templates.

An electronic circuit includes a first printed wiring board, a second printed wiring board and a third printed wiring board. The second printed wiring board is mounted such that one edge of the second printed wiring board abuts on a part mounting surface of the first printed wiring board on which a part is mounted. The third printed wiring board is mounted such that one edge of the third printed wiring board abuts on the part mounting surface. The second and third printed wiring boards are connected to each other in a state where plate thickness directions thereof are oriented in different directions from each other about a normal line to the part mounting surface. Further, at least one of the second printed wiring board and the third printed wiring board is provided with an antenna pattern.

Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

A flight control device includes a housing, a main control board provided in the housing, an inertial measurement unit provided in the housing and electrically connected to the main control board, and a power management unit provided at the housing and electrically connected to the main control board. The main control board, the inertial measurement unit, and the power management unit are fixedly connected to and integrated with the housing as a whole.