Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.

A method of manufacturing component carriers includes carrying out a test for each of multiple sections of a component-carrier structure, inserting at least one functional component in each of further sections of a further component-carrier structure to be connected with the component-carrier structure so that each further section assigned to a respective section having successfully passed the test is provided with at least one functional component, and inserting at least one functionally inactive dummy component in each of the further sections assigned to a respective section having failed the test.

A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted.

Provided is a semiconductor module including: an insulating circuit board that includes an insulating board and a conductive circuit pattern provided on an upper surface of the insulating board; a semiconductor chip that is provided above the insulating circuit board; a solder portion that bonds the circuit pattern and the semiconductor chip; and one or more temperature gradient adjustment portions configured to be bonded to the insulating circuit board and have at least one surface disposed to face at least one surface of the solder portion. The insulating circuit board is warped in a first direction. At least one of the temperature gradient adjustment portions is disposed at a place where an amount of warpage of the insulating circuit board in the first direction is smaller than an average amount of warpage of the insulating circuit board in the first direction.

Provided is a semiconductor module including: an insulating circuit board that includes an insulating board and a conductive circuit pattern provided on an upper surface of the insulating board; a semiconductor chip that is provided above the insulating circuit board; a solder portion that bonds the circuit pattern and the semiconductor chip; and one or more temperature gradient adjustment portions configured to be bonded to the insulating circuit board and have at least one surface disposed to face at least one surface of the solder portion. The insulating circuit board is warped in a first direction. At least one of the temperature gradient adjustment portions is disposed at a place where an amount of warpage of the insulating circuit board in the first direction is smaller than an average amount of warpage of the insulating circuit board in the first direction.

A wiring board includes a first insulating layer, a pad formed on one surface of the first insulating layer, a second insulating layer, formed on the one surface of the first insulating layer, and including an opening exposing the pad, and a reinforcing metal layer formed in contact with the first insulating layer, and provided around the pad so as to be separated from the pad in a plan view. The pad is disposed inside the opening without making contact with the second insulating layer. An end, on a side of the first insulating layer, in a portion of an inner side surface of the opening of the second insulating layer makes contact with the reinforcing metal layer, and an end in another portion of the inner side surface of the opening of the second insulating layer makes contact with the one surface of the first insulating layer.

A server box embodiment is disclosed that generally comprises an array of dummy HDDs that share a common set of universal disk drive components in a master components module, or power module. Each dummy HDDs is constructed without expensive onboard chipsets that control the normal functionality of a standard HDD. By sharing expensive chipsets in a master components module (power module) money can be saved in building and selling the dummy HDD server. Embodiments envision a power module possessing the needed chipset functionality that is missing in a dummy HDD. The power module can be made to move from dummy HDD to dummy HDD supplying the necessary chipset in a shared manner when data is being stored or retrieved for client or end-user.

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

An improved memory module structure includes a printed circuit board, memory units disposed on the printed circuit board, and a connection interface disposed on the printed circuit board for connection with an electronic device. The printed circuit board includes a solder pad zone having solder pads electrically connected with the memory units and the connection interface. A conduction element is combined with the solder pad zone or at least one conductor line electrically connected, in the form of bridge connection, the solder pads, in order to have the solder pads electrically connected. A memory module modification method is also provided, including removing a register from an existing dual inline memory module to expose a solder pad zone, and disposing of a conduction element or arranging a conductor line to have the memory units and the connection interface of electrically connected to thereby form an improved memory module structure.

A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.