A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

Leakage of radio-frequency radiation noise radiated from a noise source to the outside is suppressed. An electronic control device 1 includes a printed board 101 having signal grounds 104a, 104b, and 104c, and a frame ground 103a, a housing 100 accommodating the printed board 101, and a connector 105 mounted on the printed board 101. The electronic control device 1 includes a first coupling portion 301 that AC-couples the signal ground 104a with the frame ground 103a and a second coupling portion 301 that electrically couples the frame ground 103a with the housing 100, and the first coupling portion 301 and the second coupling portion 301 are provided between the connector 105 and an electronic circuit 110 on the printed board 101.

A module includes a substrate having a first surface and at least one recess on the first surface, and an electronic component mounted on the first surface. The electronic component is connected to the substrate via a plurality of bumps. All of the plurality of bumps are connected to the first surface inside any of the at least one recess. A height of the plurality of bumps is greater than a depth of the at least one recess. When viewed in a direction perpendicular to the first surface, a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess.

A hob apparatus includes a sensor unit configured to detect a sensor signal, an electronic signal processing unit configured to further process and/or analyze the sensor signal, and a printed circuit board, on which the sensor unit and the signal processing unit are arranged together.

The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

A backplane connector includes a housing and a number of terminal modules. Each terminal module includes a number of conductive terminals, a metal shield surrounding member, a first metal shield and a second metal shield. The conductive terminal includes a mating portion and a tail portion. The conductive terminals include a first signal terminal and a second signal terminal. The metal shield surrounding member surrounds the mating portions of the first signal terminal and the second signal terminal. The first metal shield and the second metal shield are in contact with the metal shield surrounding member. As a result, the shielding area is increased and the shielding effect is improved.

According to an embodiment disclosed in the specification, an electronic device comprises a battery disposed inside the electronic device; a printed circuit board (PCB) disposed inside the electronic device; at least one electronic component disposed on the PCB; and a first buck converter having a first end and a second end, wherein the first end is routed to the battery; and a second buck converter having a first end and a second end, wherein the first end is selectively electrically connected to the second end of the first buck converter, and the second end is routed to the at least one electronic component, and wherein the first buck converter and the second buck converter are configured to boost a voltage provided from the battery through an electrical path formed from the battery by the first end of the first buck converter, and the second end of the first buck converter, the first end of the second buck converter and the second end of the second buck converter to the at least one electronic component.

A semiconductor module includes a main board and external terminals. A package substrate includes a core insulation layer, a conductive pattern disposed in the core insulation layer and electrically connected with the external terminals, an upper insulation pattern and a lower insulation pattern. At least one semiconductor chip is disposed on an upper surface of the package substrate and is electrically connected with the conductive pattern. A shielding plate is disposed on a molding member and lateral side surfaces of the package substrate and shields electromagnetic interference (EMI) emitted from the semiconductor chip. A shielding fence extends from an edge portion of a lower surface of the lower insulation pattern and directly contacts the upper surface of the main board. The shielding fence surrounds the external terminals and shields EMI emitted from the external terminals. A reinforcing member increases a strength of the shielding fence.

An electronic device including a shielding member for performing an electromagnetic interference (EMI) shielding function is provided. The electronic device includes a printed circuit board including a first area in which first electronic components having a first frequency as a driving frequency are mounted, and a second area in which second electronic components having a second frequency as a driving frequency are mounted, a shielding film disposed to cover the first area and the second area of the printed circuit board and attached to a first ground portion of the printed circuit board, and at least one conductive member formed to extend in a direction perpendicular to an extending direction of the printed circuit board. The at least one conductive member includes a first end that contacts the shielding film, and a second end that contacts a second ground portion of the printed circuit board, the second end being disposed between the first area and the second area of the printed circuit board.

A display device includes a display panel, a printed circuit board attached to the display panel and including a ground potential supply terminal, a circuit, and a wiring pattern electrically coupling the ground potential supply terminal and the circuit, and a housing that contacts a coupling place provided to the wiring pattern and is attached to the printed circuit board through the coupling place. The wiring pattern includes a terminal wiring pattern electrically coupled with the ground potential supply terminal, a circuit wiring pattern branched from a branch part at a predetermined position on the terminal wiring pattern and electrically coupled with the circuit, and a housing wiring pattern branched from the branch part of the terminal wiring pattern and electrically coupled with the coupling place, and the circuit wiring pattern and the housing wiring pattern are uncoupled with each other at any place other than the branch part.