H05K2201/10393

CONNECTING METHOD AND CONNECTOR ASSEMBLY
20220344844 · 2022-10-27 ·

In a connecting method, when a flexible conductor is exposed on a top surface of a connection object, a contact is disposed on the top surface of the connection object at the predetermined position in a state where the connection object is kept as it is, and when the flexible conductor is exposed on a bottom surface of the connection object, the contact is disposed on the top surface of the connection object at the predetermined position in a state where a part of the connection object where the connection part is disposed is inverted such that the connection part faces a top surface side of the connection object while being retained at the predetermined position.

SOLDERING AID, ASSEMBLY, AND METHOD FOR SECURING A STRANDED CORE ON A CONTACT SURFACE OF A PRINTED CIRCUIT BOARD
20230083275 · 2023-03-16 ·

A soldering aid for securing a stranded core of a cable on an electrical contact surface of a printed circuit board includes an outer part having a receptacle and a bearing surface, and an inner part that is displaceably received inside the receptacle of the outer part. The inner part has an access opening through which the contact surface is accessible and can be fastened to the outer part in an assembly position. In an inserted position of the inner part in the outer part, an insertion opening in the inner part is aligned with an insertion opening in the outer part for inserting the stranded core of the cable.

DISPLAY DEVICE

A display device includes: a circuit substrate including a plurality of pixel circuit units and a plurality of pads on a first surface thereof, the plurality of pads being electrically connected to the pixel circuit units; a display substrate on the circuit substrate and including a plurality of light emitting elements electrically connected to the pixel circuit units; a circuit board on the circuit substrate and including a plurality of circuit board pads electrically connected to the pads; a heat dissipation substrate on a second surface of the circuit substrate, the second surface being opposite to the first surface; and a cover substrate on the heat dissipation substrate and partially overlapping the circuit substrate and the circuit board. Each of the plurality of pads is in direct contact with at least one of the plurality of circuit board pads.

Screw boss assembly
11664614 · 2023-05-30 · ·

A screw boss assembly, including: a plastic substrate, including: a bottom surface including a first channel; an indented surface; a sidewall surface connecting the bottom surface and the indented surface, the sidewall surface including second channels, each of the second channels connected to the first channel; a metal insert, including: a first contacting member; second contacting member; connecting members connecting the first contacting member to the second contacting member; wherein the metal insert is coupled with the plastic substrate such that the first contacting member is positioned within the first channel and the connecting members are positioned within respective second channels.

SEALED CIRCUIT BOARD CONNECTORS AND ELECTRONIC DEVICE INCLUDING SAME

An apparatus according to one embodiment of the present disclosure comprises a first circuit board; a first connector provided on one face of the first circuit board; a second circuit board disposed on the one face of the first circuit board, and electrically connected to the first circuit board; a second connector provided on one face of the second circuit board, and engaged with the first connector to electrically connect the second circuit board to the first circuit board; a sealing member disposed between the first circuit board and the second circuit board to seal a space between the first connector and the second connector; and a coupling member coupling the first circuit board and the second circuit board to each other.

COWLING FOR BOARD-TO-BOARD CONNECTORS

Cowlings described herein for board-to-board connectors can provide high stiffness, low weight, and low total cost. Such cowlings can provide ribs with increased thickness for targeted stiffness to resist bowing in a given direction. The layers of the cowlings can include carbon fiber extending in directions parallel to the ribs in some layers and transverse to the ribs in other layers. The layers can be formed together within a mold tool that shapes the fibers into the ribs.

OVERVOLTAGE PROTECTION ARRANGEMENT FOR INFORMATION AND TELECOMMUNICATION TECHNOLOGY
20170366000 · 2017-12-21 ·

The invention relates to an overvoltage protection arrangement for information and telecommunication technology, consisting of a housing with means formed on the housing base for mounting top-hat rails, overvoltage protection elements which can be found in the housing, electric connection means, and at least one circuit board as a wiring support for the overvoltage protection elements. When viewed laterally, the housing is designed approximately in the shape of a T standing on its head and has a beam-shaped main part with a protruding head part, wherein the electric connection means can be accessed and actuated via the upper face of the beam-shaped main part. A first and second circuit board are located on a respective inner face of the lateral walls of the housing in a mutually spaced manner, and the electric connection means in the form of electric connection terminals, connection sockets, and/or plugs for example are arranged in the spacing between the first and second circuit board such that first connection means can be accessed on the horizontal plane of the beam-shaped main part and second connection means can be accessed on the vertical plane of the beam-shaped main part. The flat shape of the circuit board corresponds to the T shape of the housing or approximates the shape of the housing.

Pogo pin integrated circuit package mount

Apparatuses, systems and methods associated with electrical fast transient tolerant input/output (I/O) communication (e.g., universal serial bus (USB)) design are disclosed herein. In embodiments, an apparatus to mount an integrated circuit (IC) package, may include a printed circuit board (PCB), a plurality of pogo pins, and a mounting mechanism. The plurality of pogo pins may be mounted to electrical contacts of the PCB, the plurality of pogo pins may be coupled to the electrical contacts at first ends of the plurality of pogo pins and may be to couple to the IC package at second ends of the plurality of pogo pins. The mounting mechanism may position the IC package on the second ends of the plurality of pogo pins. Other embodiments may be described and/or claimed.

MOTOR FAN AND GUARD FOR DIRECTING COOLANT AIR

An electric motor assembly includes a stator, a rotor, a motor housing, a rotatable shaft, a radial fan, and an air scoop. The motor housing at least partly houses the stator and rotor and presents an exterior motor surface. The rotatable shaft is associated with the rotor for rotational movement therewith, with the rotatable shaft extending along a rotational axis. The radial fan is mounted on the rotatable shaft exteriorly of the motor housing and is rotatable with the shaft to direct airflow in a radially outward direction. The air scoop extends radially outwardly relative to the radial fan and axially to receive radial airflow from the radial fan and turn the airflow axially to flow along the exterior motor surface. The air scoop includes spaced apart axially extending airflow vanes to guide the airflow as the airflow is turned axially.

MICRO DEVICE WITH ADAPTABLE THERMAL MANAGEMENT DEVICE
20230180379 · 2023-06-08 ·

Micro devices having enhanced through heat transfer utilizing plungers extending from a heat spreader are provided. In one example, a micro device is provided that includes a plunger retaining block, a plurality of plungers, a mounting substrate and an integrated circuit (IC) die. The plunger retaining block includes a top surface and a bottom surface. The plurality of plungers extend from the bottom surface of the plunger retaining block with at least some of the plurality of plungers contacting the IC die. The IC die is disposed between the plunger retaining block and the mounting substrate, and coupled to the mounting substrate.