A circuit board includes: a base body formed of ceramics or sapphire, the base body being provided with a through hole which penetrates therethrough from one principal face to another principal face of the base body; a through conductor containing silver as a major constituent, the through conductor being located inside the through hole of the base body; metallic wiring layers located on the respective principal faces of the base body and on the through conductor; and regions in which a compound containing at least one substance selected from Sn, Cu, and Ni is present between the through conductor and the metallic wiring layers.

An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

This wiring module includes: a wiring substrate; a base portion at which the wiring substrate is placed; and an adhesive layer configured to adhere the wiring substrate to the base portion, wherein the wiring substrate includes: a land portion configured to have a power generating element mounted thereto; and a wire portion configured to be electrically connected to the power generating element, the adhesive layer has: a land adhesion region configured to adhere the land portion to the base portion; and a wire adhesion region configured to adhere the wire portion to the base portion, and a width of the wire adhesion region is smaller than a width of the land adhesion region.

This power generation module includes: a power generating portion (30) including a power generating element (19); and a wiring substrate. The wiring substrate includes: a reinforcement plate; and a flexible printed circuit (79) provided above the reinforcement plate. The flexible printed circuit (79) has: an FPC land portion (70) configured to have the power generating portion (30) mounted thereto; and a FPC wire portion (73) connected to the FPC land portion (70). The width of the FPC wire portion (73) is smaller than the width of the FPC land portion (70).

An antenna module of the present disclosure includes a control substrate having a flat plate shape and configured to house or mount a semiconductor element; a frame substrate bonded to an upper surface of the control substrate via bonding members and exposing a center portion of the upper surface of the control substrate; and an antenna substrate having a flat plate shape, bonded to an upper surface of the frame substrate via the bonding members so as to face the control substrate, and provided with a plurality of antenna patterns disposed along a main surface of the antenna substrate. The frame substrate includes a frame main body and a crosspiece. Between the frame main body/the crosspiece and the control substrate as well as the antenna substrate, projecting portions that come into contact with the opposing control substrate, frame substrate, and antenna substrate are provided at a fixed height.

In an electro-optical device, a flexible first wiring substrate and a flexible second wiring substrate, which are respectively coupled to a first terminal region and a second terminal region, extend while overlapping with each other, and a first mold material is provided between the first wiring substrate and the second wiring substrate. The second wiring substrate includes a base film having transmissivity, a wiring line provided at the base film, and a protective layer that covers the wiring line and is less transmissive than the base film. In the second wiring substrate, a light-transmission window in which the wiring line and the protective layer are not present in part is provided in a region thereof overlapping with the first mold material.

In an electro-optical device, a flexible first wiring substrate and a flexible second wiring substrate, which are respectively coupled to a first terminal region and a second terminal region, extend while overlapping with each other, and a first mold material is provided between the first wiring substrate and the second wiring substrate. The second wiring substrate includes a base film having transmissivity, a wiring line provided at the base film, and a protective layer that covers the wiring line and is less transmissive than the base film. In the second wiring substrate, a light-transmission window in which the wiring line and the protective layer are not present in part is provided in a region thereof overlapping with the first mold material.

A method is provided for manufacturing an electrical connection assembly includes preparing a connector (CN) in which each terminal (20) has a conductor connection surface (27a) exposed from an insulating housing (30), bringing parts of conductors and the conductor connection surfaces (27a) corresponding thereto into contact and connecting both while tension is applied to a wiring material (10). The method further includes fixing the wiring material (10) to the insulating housing (30) by bringing the wiring material (10) and the insulating housing (30) into contact with each other at the fixing positions separated in the longitudinal direction of the wiring material (10) from the parts to be connected and solidifying the fixing portions (34) of the insulating housing (30) after melting the fixing portions at the fixing positions.

This power generation circuit unit includes a wiring substrate and a plurality of power generating elements mounted to the wiring substrate. The wiring substrate includes: a first substrate (32E) and a second substrate (32F) to each of which the power generating element is mounted; and a coupling portion (33L) configured to couple the first substrate (32E) and the second substrate (32F) together. The first substrate (32E) can be disposed at least two positions of: a first position separated from the second substrate (32F) by a first distance; and a second position separated from the second substrate (32F) by a second distance being greater than the first distance. The coupling portion (33L) has an FPC (flexible printed circuits). In a state where the first substrate is disposed at the second position, at least a part of the coupling portion (33L) is twisted.

A printed circuit board and a display device are provided. The printed circuit board includes a plurality of insulation layers; at least one metal layer between the plurality of insulation layers; and a fixing member fixed to a surface of one of the at least one metal layer and passing through an outermost one of insulation layers to protrude to the outside.