H05K2203/01

Frame assembly for surface mount technology stencil

A framed stencil for surface mount technology (SMT) is provided. The frame assembly includes a frame member and a binding insert. The frame member includes an inner perimeter portion and an outer perimeter portion that cooperates with the inner perimeter portion to define an elongated channel. The outer perimeter portion includes a first cantilever portion that extends over the elongated channel and towards the inner perimeter portion. The binding insert is configured for releasable insertion into the elongated channel. The binding insert includes a base and a tongue. The base configured to interface with a mesh substrate to facilitate coupling therebetween. The tongue is coupled to the base and extends substantially horizontally from the base. When the binding insert is inserted into the elongated channel, the tongue extending beneath the first cantilever portion to facilitate retention of the binding insert to the frame member. Methods are also provided.

Electronic component mounting method

Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

ELECTRONIC COMPONENT MOUNTING METHOD
20230397341 · 2023-12-07 ·

Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

ELECTRONIC COMPONENT MOUNTING METHOD
20210289634 · 2021-09-16 ·

Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

Electronic component mounting method

Provided is a method for operating an electronic component mounting system including component storages including a keeping rack, a dry box and a dryer. The method includes, after a reel of a moisture sensitive device is dispatched from a component keeping area and setup to a tape feeder is performed in an external setup area, measuring a exposure time for which the moisture sensitive device is in an atmospheric exposure state is in a reel unit, and comparing the exposure time with an exposure limit time set for the moisture sensitive device and stored in a storage. The method includes stopping using the reel of the moisture sensitive device whose exposure time exceeds the exposure limit time.

FRAME ASSEMBLY FOR SURFACE MOUNT TECHNOLOGY STENCIL

A framed stencil for surface mount technology (SMT) is provided. The frame assembly includes a frame member and a binding insert. The frame member includes an inner perimeter portion and an outer perimeter portion that cooperates with the inner perimeter portion to define an elongated channel. The outer perimeter portion includes a first cantilever portion that extends over the elongated channel and towards the inner perimeter portion. The binding insert is configured for releasable insertion into the elongated channel. The binding insert includes a base and a tongue. The base configured to interface with a mesh substrate to facilitate coupling therebetween. The tongue is coupled to the base and extends substantially horizontally from the base. When the binding insert is inserted into the elongated channel, the tongue extending beneath the first cantilever portion to facilitate retention of the binding insert to the frame member. Methods are also provided.

Setup support device

A setup support device that improves the efficiency of setup of a component mounter by guiding supplying of feeders to a component supply device as preparation for setting of the feeders. The support setup device includes: a preparation cart on which are loaded multiple of the feeders used to perform multiple production jobs; and a feeder identifying section configured to identify multiple of the feeders to be set on a component supply device among the multiple feeders loaded on the preparation cart. The preparation cart includes a guidance section configured to issue guidance all at once for the identified multiple feeders to an operator performing the setup so as to supply the identified multiple feeders to the component supply device as preparation for setting the identified multiple feeders on the component supply device.

SETUP SUPPORT DEVICE
20190281737 · 2019-09-12 · ·

A setup support device that improves the efficiency of setup of a component mounter by guiding supplying of feeders to a component supply device as preparation for setting of the feeders. The support setup device includes: a preparation cart on which are loaded multiple of the feeders used to perform multiple production jobs; and a feeder identifying section configured to identify multiple of the feeders to be set on a component supply device among the multiple feeders loaded on the preparation cart. The preparation cart includes a guidance section configured to issue guidance all at once for the identified multiple feeders to an operator performing the setup so as to supply the identified multiple feeders to the component supply device as preparation for setting the identified multiple feeders on the component supply device.

ELECTRONIC COMPONENT MOUNTING METHOD
20190141839 · 2019-05-09 ·

After a reel of a Moisture Sensitive Device is dispatched from a component keeping area and setup to a tape feeder is performed in an external setup area, exposure time for which the Moisture Sensitive Device is in an atmospheric exposure state is timed in a reel unit, and the exposure time is compared with exposure limit time set for the Moisture Sensitive Device and stored in a storage part. An electronic component mounting apparatus equipped with the reel of the Moisture Sensitive Device whose exposure time exceeds the exposure limit time is specified, and work by the apparatus is stopped.

Electronic component mounting method

After a reel of a Moisture Sensitive Device is dispatched from a component keeping area and setup to a tape feeder is performed in an external setup area, exposure time for which the Moisture Sensitive Device is in an atmospheric exposure state is timed in a reel unit, and the exposure time is compared with exposure limit time set for the Moisture Sensitive Device and stored in a storage part. An electronic component mounting apparatus equipped with the reel of the Moisture Sensitive Device whose exposure time exceeds the exposure limit time is specified, and work by the apparatus is stopped.