A mounting device includes a mounting head, having a rotating body, which turns multiple pickup members by rotating the rotating body, in which the rotating body holds multiple pickup members, each of which being configured to pick up a component, the multiple pickup members being disposed at predetermined intervals along a predetermined circumference of the rotating body, and executes a forward rotation pickup processing of causing the pickup members to pick up the components from a supply section for supplying the components, and rotates the rotating body forwards, and when at least one of the pickup members is vacant resulting from an error of not holding the component, executes a backward rotation pickup processing which includes a processing of causing the rotating body to rotate backwards and a processing of causing the vacant pickup member to pick up the component from the supply section.

A method of performing a fully automated, single changeover process within a stencil printer includes identifying at least one item for replacement within the stencil printer, transporting an item to the stencil printer by a single change movable cart, removing a used item identified for replacement and delivering the used item to the movable cart, and installing a new item within the stencil printer from the movable cart. A system to perform a fully automated, single changeover process within a stencil printer includes a single change movable cart configured to transport an item to the stencil printer, remove a used item scheduled for replacement, and install the item within the stencil printer.

A stencil printer includes a frame, a stencil coupled to the frame, the stencil having apertures formed therein, a support assembly coupled to the frame, the support assembly including tooling configured to support the electronic substrate in a print position beneath the stencil, a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes, the print head assembly including a squeegee blade assembly and at least one paste cartridge to deposit solder paste on the stencil, and a robotic arm configured to perform functions within the stencil printer.

A delivery device is configured to deliver changeover and/or replacement items within a stencil printer. The delivery device includes a housing configured to support replacement and/or replenishment items, the housing having wheels or casters to enable the housing to roll along a relatively flat surface, at least one support structure configured to store items for the stencil printer, and one or more device configured to transport items from the delivery device to the stencil printer and from the stencil printer to the delivery device.

A system or method of fully automating a changeover and/or a replacement process within a stencil printer includes a stencil printer having at least one item scheduled for replacement within the stencil printer, a stockroom configured to store a plurality of items, and a delivery device. The delivery device is configured to transport an item of the plurality of items to the stencil printer, remove a used item scheduled for replacement, install the item of the plurality of items on the stencil printer, transport the used item to a station configured to inspect and perform one or more functions on the used item to render the used item ready for use, and transport the used item to the stockroom for future use within the stencil printer.

A work system includes multiple work devices aligned along a board conveyance line, a replenishing device having a sensor for detecting presence or absence of an interfering object and configured to move in parallel with the board conveyance line while detecting the presence or absence of the interfering object by the sensor to replenish necessary members to the multiple work devices, and a draw-out device configured to draw out at least one of the multiple work devices in a direction orthogonal to a direction along the board conveyance line. When a draw-out request for the work device is made, the replenishing device performs an automatic draw-out process of moving to a position in which a draw-out position of the work device to be pulled forward is included within a detection range of the sensor, so as to determine whether the interfering object is detected by the sensor.

A robot apparatus according to an embodiment of the present technology includes a first robot and a second robot. The first robot includes a first hand section and a first control section. The first hand section is configured to be capable of holding one part of a work. The first control section is configured to be capable of controlling the first hand section and generating a reference signal including information about an action of the first hand section. The second robot includes a second hand section and a second control section. The second hand section is configured to be capable of holding another part of the work. The second control section is configured to be capable of selectively executing a first control mode that controls the second hand section and a second control mode that controls the second hand section by cooperating with the first hand section on the basis of the reference signal.

A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.

A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.