According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.

A system for manufacturing an assembly board includes an undersupporting device, a transporter configured to transport a board and the undersupporting device, an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device, a board processor configured to perform a predetermined processing to an upper surface of the board, a carry-in side delivering unit having first and second receiving positions different from each other, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The transporter transports, to the carry-in side delivering unit, the undersupporting device detached from the undersupporting-device installer. The carry-in side delivering unit positions, at the second receiving position, the undersupporting device delivered from the transporter to allow the undersupporting device to be carried out from the second receiving position.

System for manufacturing an assembly board includes an undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, a carry-in side delivering unit having different first and second receiving positions, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The carry-in side delivering unit delivers, to the transporter, the undersupporting device supplied to the second receiving position. The transporter transports, to a working position, the undersupporting device delivered from the carry-in side delivering unit. The undersupporting-device installer fixes, to the undersupporting-device installer, the undersupporting device transported to the working position. The carry-in side delivering unit delivers, to the transporter, the board supplied to the first receiving position. The transporter transports, to the working position, the board delivered from the carry-in side delivering unit.

A system for manufacturing an assembly board includes an undersupporting device, a carrier configured to hold the undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, and a magnet provided on a lower surface of the undersupporting device. The transporter transports the undersupporting device to a working position by transporting the carrier to the working position while the carrier holds the undersupporting device on the lower surface of the carrier. The transported undersupporting device is fixed to the undersupporting-device installer by a magnetic force of the magnet at the working position. The transporter transports the board to the working position. The undersupporting device supports the lower surface of the board when the board is transported to the working position. The board processor performs a predetermined processing to an upper surface of the board.

Provided is an air-permeable sheet (3) to be used in a state of being interposed between a suction stage (1) and an air-impermeable substrate (4) when printing is performed by a sheet-fed method on the surface of the substrate (4) fixed by suction to the suction stage (1), the air-permeable sheet capable of printing a desired printing pattern on the surface of the substrate with high accuracy.

The air-permeable sheet (3) includes a non-woven fabric layer (3b) and a support layer (3a) constituted by a woven fabric or knitted fabric.

A tray for a panel exposure machine, and also such a machine, enabling a panel to be retained and pressed down so as to be presented facing an exposure device. The tray comprises a work surface (13) adapted to receive panels of different sizes, said work surface (13) being substantially plane and possessing first and second adjacent edges (13a, 13b) extending along substantially orthogonal first and second directions (X, Y) defining a reference corner (C); and first and second holder devices (30a, 30b) of a first type and at least a first holder device (40a) of a second type, each holder device being actuatable between a holding, first state in which it exerts pressure directed towards the work surface (13), thereby defining a holding position, and a rest, second state in which said pressure is released; a positioning device (14) arranged along at least a portion of the first edge (13a) and along at least a portion of the second edge (13b); the holder devices (30a, 30b) of the first type extend along at least a portion of the first and second edges (13a, 13b) respectively, their holding positions being fixed in a plane parallel to the work surface; the holder device (40a) of the second type is movable in a plane parallel to the work surface (13) in order to adapt its holding position as a function of the size of the panel in use.

The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

An object stage and a hot pressing apparatus are disclosed. The object stage includes a base (1) and a support device (2) fixed on the base (1), wherein the support device (2) includes a plurality of detachable support sub-devices (21): the support device is configured to allow a printed circuit board (3) with at least one protruding structure (4) to be placed thereon, and no support sub-device (21) is disposed at a position on the support device (2) corresponding to the protruding structure (1). The object stage reduces manufacture cost, saves production time and improves production efficiency.

Disclosed is a surface treatment device. The surface treatment device includes: a frame; a disc hanger; two support wheels for supporting the disk hanger; a rotation drive mechanism for driving the disk hanger supported on the two support wheels to rotate; a vertical spray rack for spraying liquid medicine on the circuit board on the disk hanger; and a lift mechanism for driving the vertical spray rack up and down.