A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.

A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.

A terminal device comprises a component and a circuit board. The circuit board comprises a circuit substrate and a solder mask layer, and wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer. Openings with different depths are provided in the circuit board, and at least part of the component is accommodated in or arranged corresponding to the opening. This lowers an installation height between the component and the circuit board without affecting their performance.

A printed circuit board includes a first insulating layer, a first metal layer disposed on the first insulating layer and including a first oxidation region on a side surface thereof, and a second metal layer disposed on the first metal layer. A method of manufacturing a printed circuit board includes forming a first metal layer on a first insulating layer, forming a second metal layer on a portion of the first metal layer, oxidizing another portion of the first metal layer to form a first oxidation region, and removing at least a portion of the first oxidation region.

A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

A provided circuit board includes an embedded capacitor, a substrate, and an insulating layer. The embedded capacitor includes a dielectric layer, a first electrode and a second electrode. The dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface. The first and second electrodes respectively cover the first and third side surfaces. The substrate surrounds the embedded capacitor and is physically connected to the second and fourth side surfaces. The first electrode is between the first side surface and a sidewall of the substrate. The insulating layer covers the embedded capacitor and the substrate and extends from an upper surface to a lower surface of the substrate along the first electrode and the sidewall of the substrate.

A method of manufacturing circuits of a substrate of a display device is provided. The method includes aligning and attaching a mask with multiple slots to a circuit area of the substrate; printing a printing material in the slots of the mask using an inkjet printing technology, so that the printing material is attached to the circuit area; removing the mask from the substrate; and curing the printing material on the circuit area to form a plurality of the circuits.

A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

A provided circuit board includes an embedded capacitor, a substrate, and an insulating layer. The embedded capacitor includes a dielectric layer, a first electrode and a second electrode. The dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface. The first and second electrodes respectively cover the first and third side surfaces. The substrate surrounds the embedded capacitor and is physically connected to the second and fourth side surfaces. The first electrode is between the first side surface and a sidewall of the substrate. The insulating layer covers the embedded capacitor and the substrate and extends from an upper surface to a lower surface of the substrate along the first electrode and the sidewall of the substrate.