The present disclosure provides a printed circuit board and a wire arrangement method thereof. The printed circuit board includes a packaged chip and at least two connectors, wires of the packaged chip that are connected to different connectors are distributed on different board layers; and when the packaged chip is connected to one of the connectors, a via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out. The wires of the packaged chip that are connected to different connectors are distributed on different board layers. When the packaged chip is connected to one of the connectors, according to backdrilling of different depths, the via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out.

A carrier assembly may include a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending up to a first area provided on one of two extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area, and a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on that second area.

A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.

The disclosed system generally comprises a damping module, a pressing module, a placement platform for placement of the multiple stacked planar objects and a compensatory mechanism engaging to the damping module. Particularly, the damping module includes a damper, a resilient component and an elongate support which are all arranged within a holder. Each of the stacked planar objects has a top planar surface and an underside planar surface as well as carries a plurality of corresponding holes, which become aligned accordingly to form a plurality of longitudinal grooves upon placement onto the platform. The head portion of the damper is substantially aligning with the positioned groove and abutting onto the underside surface of the bottommost stacked object. The compensatory mechanism is capable of adaptively adjusting position of the head portion of the damper in relation to the pressing ram at the vertical and/or horizontal plane.

Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core. In an embodiment, the core comprises a first sub-core layer and a second sub-core layer. In an embodiment, a via is provided through the first sub-core layer and the second sub-core layer. In an embodiment, the via comprises a first hourglass shape in the first sub-core layer and a second hourglass shape in the second sub-core layer. In an embodiment, a front-side buildup layer is over the core and a backside buildup layer is under the core.

The invention relates to a method for producing a heatable radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material.

A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.

Various implementations include force elements for electronic devices. In some aspects, a force element includes: an outer ring surrounding a central axis and having a first diameter; an inner ring surrounding the central axis and having a second diameter that is smaller than the first diameter; an outer wall connecting a radially inner portion of the outer ring with a radially outer portion of the inner ring; an inner wall extending from a radially inner portion of the inner ring and located radially inboard of the outer wall; and a central platform extending from the inner wall around the central axis.

The disclosed system generally comprises a damping module, a pressing module, a placement platform for placement of the multiple stacked planar objects and a compensatory mechanism engaging to the damping module. Particularly, the damping module includes a damper, a resilient component and an elongate support which are all arranged within a holder. Each of the stacked planar objects has a top planar surface and an underside planar surface as well as carries a plurality of corresponding holes, which become aligned accordingly to form a plurality of longitudinal grooves upon placement onto the platform. The head portion of the damper is substantially aligning with the positioned groove and abutting onto the underside surface of the bottommost stacked object. The compensatory mechanism is capable of adaptively adjusting position of the head portion of the damper in relation to the pressing ram at the vertical and/or horizontal plane.

A bending apparatus includes a first height control part which ascends in a first direction and descends in a direction opposite to the first direction, a second height control part spaced apart from the first height control part in a second direction crossing the first direction, and which ascends in the first direction and descends in the direction opposite to the first direction, a first rotation part attached to the first height control part, and which rotates with respect to a rotation axis, a second rotation part attached to the second height control part, and which rotates with respect to the rotation axis, and a supporting part disposed between the first and second rotation parts, where a first end of the supporting part is attached to the first rotation part, and a second end of the supporting part is attached to the second rotation part.