A vertical circuit board printer includes a multi-layer conveyor, a printer assembly, and a control system. The multi-layer conveyor includes a number of front conveyors and one rear conveyor. Each upper front conveyor is coupled to a lower front conveyor by a circuit board-lowering mechanism to transport a number of circuit boards in sequence from the number of front conveyors to the rear conveyor. The printer assembly includes a number of printers arranged in sequence above the number of front conveyors. The control system controls operation of the multi-layer conveyor and controls operation of the printing assembly through a software system.

The present invention provides a maintenance board that can be used for a maintenance process other than removing static electricity from a component mounting device by being conveyed by a conveyance device of the component mounting device. The maintenance board is conveyed to the conveyance device of the component mounting device. The maintenance board includes at least one of: a brush configured to brush a maintenance target object; a cleaning nozzle configured to be held in an attachable manner to a work head of the component mounting device and to blow air to the maintenance target object; a pressure sensor configured to measure a detachable load of a component to a suction nozzle attached to the work head and a mounting load of a component to a board; and a blower configured to blow air toward the work head.

Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.

Devices, systems, and methods for making and using circuit assemblies having a pattern of deformable conductive material formed therein are disclosed herein. In various aspects, a circuit assembly can include a substrate layer; a first pattern of deformable conductive material formed on a surface of the substrate layer using a removable stencil; and a first stacked layer configured to cover at least a portion of the first pattern of deformable conductive material.

Deformable electrical contacts with conformable target pads for microelectronic assemblies and other applications are provided. A plurality of deformable electrical contacts on a first substrate may be joined to a plurality of conformable pads on a second substrate during die level or wafer level assembly of microelectronics, for example. Each deformable contact deforms to a degree that is related to the amount of joining pressure between the first substrate and the second substrate. The deformation process also wipes each respective conformable pad with the deformable electrical contact to create a fresh metal-to-metal contact for good conduction. Each conformable pad collapses as pressured by a compressible material to assume the approximate deformed shape of the electrical contact, providing a large conduction surface area, while also compensating for horizontal misalignment. Temperature can be raised to melt a dielectric, which encapsulates the electrical connections, equalizes gaps and variations between the two substrates, and permanently secures the two substrates together.

A process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board with the sliding rheostat slides along between two bonding pads, includes the following steps: outer layer etching; resin plugging: a. plugging the resinous ink into the pre-plugging position; b: baking, baking on the baking plate of the oven after the plugging is finished: board polishing: using a ceramic brush to process the plugged board, then using a non-woven fabric blush to polish the surface that is polished by ceramic brush. The present invention provides a process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board. The resin plugging method is used to plug the gap between the conductors of the sliding rheostat, so as to prevent the sliding rheostat from being unable to slide due to the altitude difference between conductors of the high-frequency signal board.

An apparatus that cleans end surfaces of a substrate includes: a guide unit including a guide portion that has a channel, through which an end surface of a substrate passes, formed in a front surface thereof; and a brush with a front end whose position is controlled by a rear surface of the guide portion. The channel includes an opening that extends through the guide portion and the front end of the brush contacts an end surface of a substrate passing through the channel via the opening. The guide unit includes a concave portion in which at least the front end of the brush is housed and a suction hole that sucks dust from the concave portion.

An apparatus that cleans end surfaces of a substrate includes: a guide unit including a guide portion that has a channel, through which an end surface of a substrate passes, formed in a front surface thereof; and a brush with a front end whose position is controlled by a rear surface of the guide portion. The channel includes an opening that extends through the guide portion and the front end of the brush contacts an end surface of a substrate passing through the channel via the opening. The guide unit includes a concave portion in which at least the front end of the brush is housed and a suction hole that sucks dust from the concave portion.

An electrical conductor includes a first conductive layer including a plurality of metal oxide nanosheets, wherein a metal oxide nanosheet of the plurality of metal oxide nanosheets includes a proton bonded to a the surface of the metal oxide nanosheet, wherein the metal oxide is represented by Chemical Formula 1:
MO.sub.2Chemical Formula 1
wherein M is Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, or Mn, wherein the plurality of metal oxide nanosheets has a content of hydrogen atoms of less than about 100 atomic percent, with respect to 100 atomic percent of metal atoms as measured by Rutherford backscattering spectrometry, and wherein the plurality of metal oxide nanosheets includes an electrical connection between contacting metal oxide nanosheets.

An electrical conductor includes a first conductive layer including a plurality of metal oxide nanosheets, wherein a metal oxide nanosheet of the plurality of metal oxide nanosheets includes a proton bonded to a the surface of the metal oxide nanosheet, wherein the metal oxide is represented by Chemical Formula 1:

MO.sub.2 Chemical Formula 1

wherein M is Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, or Mn, wherein the plurality of metal oxide nanosheets has a content of hydrogen atoms of less than about 100 atomic percent, with respect to 100 atomic percent of metal atoms as measured by Rutherford backscattering spectrometry, and wherein the plurality of metal oxide nanosheets includes an electrical connection between contacting metal oxide nanosheets.