A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, and are configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion. The multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A welding structure and a display module. The welding structure includes: an output carrier, arranged with a first welding area on a side edge of the output carrier; an input carrier. A first end of the input carrier is arranged with a second welding area, the second welding area being electrically connected to the first welding area; an orthographic projection of the first end of the input carrier on the output carrier is disposed beyond the first welding area; and at least one set of a first support member and a second support member. The first support member is disposed on the input carrier and at a position of the first end beyond the first welding area; the second support member is disposed on the output carrier and opposite to the first support member.

This invention discloses a simplified pen core module and the preparation method thereof. The pen core module is characterized in that it adopts PCB board as the main body of pen core, and the PCB board is covered with FPC boards that serve as pins; a hollow threaded seat is sleeved at the strip part of the PCB board, and is electrically connected with and fixed at the root step of the strip part; a hollow metal cylinder and a hollow cone part are sleeved in sequence at the relative position of the strip part of the PCB board and, through the hollow interior thereof, electrically connected with the bonding pad of the PCB board and fixed at the relative position; a heat resisting insulation ring is sleeved between every two of the threaded seat, metal cylinder and cone part.

A PCB structure and a method and apparatus for forming the PCB structure are disclosed. The PCB structure further includes a metal plate configured between a first PCB and a second PCB by soldering. Therefore, the PCB structure is easy to be produced and the feasibility can be improved with a cheap solution.

An image sensor attached to a printed circuit board is installed in a camera. A holder includes first and second rails comprising first and second printed circuit boards, respectively, and the holder is fastened to a lens mount of the camera. The holder may be fastened to captively hold the image sensor, and the image sensor may be resiliently supported when captively held. A gripper grasps the image sensor proximate to the holder and aligns the image sensor to an aligned position of the image sensor relative to the lens mount. The image sensor may be moved to the aligned position after directing an image toward the image sensor to produce a processed image for determining relative alignment. The printed circuit board is soldered to the first and/or second printed circuit board such that the holder fixedly holds the image sensor so it is unmovable in its aligned position.

A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

A conductive terminal structure for a piezoelectric device used as part of a tire mountable apparatus is provided. Unlike known electrical connection structures which include a plurality of conductive terminals that are all exposed through a single insulating layer of the piezoelectric device, such as a top layer of the piezoelectric device, the electrical connection structure can be arranged in a one up, one down configuration. In this configuration, at least one conductive terminal is exposed through a top insulating layer of the piezoelectric device. In addition, at least one conductive terminal of a piezoelectric component is exposed through a bottom insulating layer of the piezoelectric device. The electrical connection structure can be used in combination with a connector assembly design to preserve the integrity of the electrical connection between the electrical and mechanical connection structure and a printed circuit board.