An apparatus for storing and retrieving electronic components such as, but not limited to: capacitors; resistors; and integrated circuits. Components are stored based on single package single location in lockable racks in a transportable cart. Information for each stored component, such as its part number, location, and quantity is stored in the local electronic board and is shared via Wi-Fi to a network of PCs.

A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.

An apparatus for storing and retrieving electronic components such as, but not limited to: capacitors; resistors; and integrated circuits. Components are stored based on single package single location in lockable racks in a transportable cart. Information for each stored component, such as its part number, location, and quantity is stored in the local electronic board and is shared via Wi-Fi to a network of PCs.

A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a tertiary cyclohexanediols of Formulae V and VI are disclosed, which are useful in the forming of microelectronic assemblies: ##STR00001##
a representative example of a dicarboxylic acid is an oxalic acid and representative example of thermally decomposable polyester is the polyester of the formula: ##STR00002##
wherein m is at least about 100.

A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a difunctional tertiary alcohol are disclosed, which are useful in the forming of microelectronic assemblies. A representative example of a composition comprises a thermally decomposable polyester of the formula:

##STR00001##

wherein m is at least about 100.

Provided is a non-electroconductive flux capable of enhancing productivity and impact resistance of a connected structure to be obtained and suppressing occurrence of solder flash. The non-electroconductive flux according to the present invention contains an epoxy compound, an acid anhydride curing agent, and an organophosphorus compound.