The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.

A method for forming a resist fine pattern uses inkjet printing for printing an ink along a path to form a resist fine pattern on a substrate having the same surface energy. The method includes an ejecting step of simultaneously discharging a photocurable resist ink and a partition-forming ink that are spaced from each other on the front side and the rear side of the path and applying the light energy to the discharged photocurable resist ink. The intensity of light is set so that, as the photocurable resist ink is semi-cured and is ejected on the substrate in a gelatinous state, the ink forms a boundary that is vertical with respect to the partition-forming ink ejected on the substrate and the spreading of the photocurable resist ink is prevented, and the photocurable resist ink is cured after both the photocurable resist ink and the partition-forming ink are completely ejected.

The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: applying an insulating layer (20) (S1) onto the printed circuit (10), forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, filling the cavity (22) with a solder paste (3), positioning the SMD over the cavity (22) (S4), and applying a heat treatment (S5) to the printed circuit (10).

The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: applying an insulating layer (20) (S1) onto the printed circuit (10), forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, filling the cavity (22) with a solder paste (3), positioning the SMD over the cavity (22) (S4), and applying a heat treatment (S5) to the printed circuit (10).

Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of removing the film from a surface to a midway thereof to form a conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing a conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste.

Provided is a method for fabricating a strain-pressure complex sensor and a sensor fabricated thereby. This method includes coating a fabric with a graphene oxide; reducing the graphene oxide coated with the fabric to form a graphene; disposing carbon nanotubes on the fabric coated with the graphene; and connecting an electrode to the fabric.

The manufacturing method of the flexible printed wiring board relating to an embodiment includes a step of preparing a metal foil clad laminate 1 including an insulating substrate 2 and metal foil 3 and metal foil 4 provided on main surfaces of the substrate 2, a step of forming a circuit pattern 5 by patterning the metal foil 3, a step of forming a peelable printing plate layer 6 on the substrate 2 so as to embed the pattern 5, a step of forming blind holes 7a and 7b where the pattern 5 is exposed inside by partially removing the printing plate layer 6, a step of printing conductive paste with the printing plate layer 6 as a printing mask, and filling the conductive paste 8 inside the blind holes, and a step of peeling off the printing plate layer 6 from the metal foil clad laminate 1.

Methods of forming a microelectronic structure are described. Those methods comprise forming a stress compensation layer on a substrate, forming at least one opening within the stress compensation layer, and forming an interconnect paste within the at least one opening.

A multilayer printed circuit board includes a first circuit board, a second circuit board and bonding films. The first circuit board includes a first dielectric layer, a first wiring pattern layer, a plurality of conductive blocks and a plurality of solder balls. The first wiring pattern layer is formed on a first surface of the first dielectric layer and the conductive blocks are formed on a second surface of the first dielectric layer. The solder balls are formed on a surface of the first wiring pattern layer. The second circuit board includes a second dielectric layer, a second wiring pattern layer, second conductive blocks and conductive pillars. The second wiring pattern layer is formed on a third surface of the second dielectric layer and the second conductive blocks are formed on a fourth surface thereof. The conductive pillars are formed on the second wiring pattern layer.