A method of producing a multilayer printed circuit board includes a metallic conductor structure including providing a base substrate including a film or plate and having first and second substrate sides, which base substrate at least partly consists of an electrically non-conductive organic polymer material and wherein the first substrate side is covered with a cover metal layer, partially removing the cover metal layer while subdividing the first substrate side into at least one first partial area, in which the first substrate side is free of the cover metal layer, and into at least one second partial area, in which the first substrate side is covered with the cover metal layer, and causing a plasma to act on the first substrate side with the aid of which plasma the polymer material is removed in the at least one first partial area while forming at least one trench.

A package that includes a substrate and an electrical component coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, and a solder resist layer located over a surface of the at least one dielectric layer. The solder resist layer includes a first solder resist layer portion comprising a first thickness, and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The electrical component is located over the second solder resist layer portion.

A package that includes a substrate and an electrical component coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, and a solder resist layer located over a surface of the at least one dielectric layer. The solder resist layer includes a first solder resist layer portion comprising a first thickness, and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The electrical component is located over the second solder resist layer portion.

A direct patterning method of touch panel is provided. A substrate having a display region and a peripheral region is provided. A periphery circuit having a bonding pad is disposed on the periphery region. A metal nanowire layer made of metal nanowires are disposed on the display region and the peripheral region. A photosensitive pre-cured layer is disposed on the metal nanowire layer. A photolithography process is performed, which includes exposing the pre-cured layer to define a removal area and a reserved area, and removing the pre-cured layer and the metal nanowire layer on the removal area using a developer solution to form a touch-sensing electrode disposed on the display region and to expose the bonding pad disposed on the periphery region. The touch sensing electrode made of the pre-cured layer and the metal nanowire layer is electrically connected to the periphery circuit.

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

A direct patterning method of touch panel is provided. A substrate having a display region and a peripheral region is provided. A periphery circuit having a bonding pad is disposed on the periphery region. A metal nanowire layer made of metal nanowires are disposed on the display region and the peripheral region. A photosensitive pre-cured layer is disposed on the metal nanowire layer. A photolithography process is performed, which includes exposing the pre-cured layer to define a removal area and a reserved area, and removing the pre-cured layer and the metal nanowire layer on the removal area using a developer solution to form a touch-sensing electrode disposed on the display region and to expose the bonding pad disposed on the periphery region. The touch sensing electrode made of the pre-cured layer and the metal nanowire layer is electrically connected to the periphery circuit.

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline soluble UV blocking composition is selectively applied to the surface of the UV blocking film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.