The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.

A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A process of manufacturing a multilayer sheet having electrically conductive patterns comprises feeding a first polymer layer and a second polymer composition to a calendering stack, the first polymer layer having an inner electrically conductive pattern disposed thereon, the first polymer layer comprising a first polymer composition, which contains a first polymer having a first glass transition temperature, and the second polymer composition comprising a second polymer and a laser direct structure additive (LDS), the second polymer having a second glass transition temperature that is 50 to 100° C. lower than the first glass transition temperature; pressing the first polymer layer and the second polymer composition together to laminate a second polymer layer which comprises the second polymer composition to the first polymer layer, the second polymer layer having an inner surface facing the inner electrically conductive pattern of the first polymer layer and an opposing outer surface; forming an activated surface pattern on the outer surface of the second polymer layer; and applying a conductive metal on the activated surface pattern, wherein the first polymer layer is in direct physical contact with the second polymer layer.

A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.