An electronic circuit, comprising: an integrated substrate structure comprising one or more electrically conductive traces comprising plating on a laser-etched, non-conductive isolated portion of the integrated substrate structure defining each electrically conductive trace; one or more electrically conductive pads at one or more predetermined positions along the one or more electrically conductive traces; and an electrical component surface mounted to the at least one electrically conductive pad with interconnect and bonding material.

Described herein are ultra-thin nanocellulose flexible electronic device on which SU-8, an epoxy material which can become highly stressed upon UV exposure, is printed on desired areas. Upon UV exposure and then release from the surface it is anchored on, the nanocellulose device will spontaneously self-mold into a desired form due to stress differences between the SU-8 and the nanocellulose sheet. The flexible electronics can be manufactured using standard printed circuit board processing techniques, including electroless metallization and soldering of surface mount components.

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

The present invention provides a manufacturing method of a curved circuit board which includes the following steps. The first step is to provide a flexible substrate. The next step is to form a patterned catalyst layer on the flexible substrate. The next step is to deposit metal on the patterned catalyst layer by electroless plating to form a wiring substrate, wherein the wiring substrate includes a planar wiring structure. The last step is to place the wiring substrate into a mold having a molding surface with a three-dimensional design, and then execute a heating process to shape the planar wiring structure to a three-dimensional wiring structure, wherein the heated wiring substrate is laminated to the molding surface of the mold. The present invention further provides an electronic product using the curved circuit board.

A novel method for the manufacturing of fine line circuitry on a transparent substrates is provided, the method comprises the following steps in the given order providing a transparent substrate, depositing a pattern of light-shielding activation layer on at least a portion of the front side of said substrate, placing a photosensitive composition on the front side of the substrate and on the pattern of light-shielding activation layer, photo-curing the photosensitive composition from the back side of the substrate with a source of electromagnetic radiation, removing any uncured remnants of the photosensitive composition; and thereby exposing recessed structures and deposition of at least one metal into the thus formed recessed structures whereby a transparent substrate with fine line circuitry thereon is formed. The method allows for very uniform and fine line circuitry with a line and space dimension of 0.5 to 10 μm.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

A wiring substrate at which a metal wire is formed includes a substrate containing a resin as a main component and an organic substance having a hydroxyl group; and a metal plating layer constituting the metal wire. A formation portion of the metal wire at one surface of the substrate is rougher than a non-formation portion of the metal wire at the one surface of the substrate, and has the organic substance in a state of being embedded in the resin, and a catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.

A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.

A method of manufacturing a structure having conductive lines is disclosed by forming a patterned catalyst material layer on a substrate; activating the patterned catalyst material layer to form an activated patterned catalyst material layer including activated catalysts; and growing a conductive layer on the activated catalysts of the activated patterned catalyst material layer. The patterned catalyst material layer is formed from a catalyst material including 40 wt % to 90 wt % of polymer and 10 wt % to 60 wt % of catalyzer. An uppermost portion of the activated patterned catalyst material layer includes the activated catalysts, and the activated catalysts include metal reduced from the catalyzer. The pattern of the conductive layer corresponds to that of the patterned catalyst material layer. The structure of the conductive line of the disclosure has the characteristics of high conductivity.