Patent classifications
H05K2203/0736
GUIDED TRANSPORT PATH CORRECTION
A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.
Solder mask inkjet inks for manufacturing printed circuit boards
A radiation curable solder mask inkjet ink contains a photo-initiator, a polymerizable compound and a flame retardant wherewith a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties and flame retardancy may be produced.
METHODS FOR DISPENSING A LIQUID OR VISCOUS MATERIAL ONTO A SUBSTRATE
Systems and methods for dispensing a liquid or viscous material onto a substrate are disclosed herein. One exemplary method of positioning an applicator of a dispensing system to apply a liquid or viscous material to an electronic substrate includes generating a two-dimensional image of the electronic substrate using a camera communicatively connected to the dispensing system. Based on the two-dimensional image of the electronic substrate, a first set of one or more sub-regions of the electronic substrate having one or more components that protrude above the surface of the electronic substrate is identified. The method further includes using height information relating to the one or more sub-regions having the one or more components to determine a control program for the dispensing system to position the applicator relative to the electronic substrate and dispense the liquid or viscous material onto the electronic substrate.
METHOD OF DISPENSING MATERIAL ON A SUBSTRATE WITH A SOLENOID VALVE OF A PNEUMATICALLY-DRIVEN DISPENSING UNIT
A method of controlling a dispensing unit is used to dispense material on a substrate. The method includes connecting a solenoid coil of a pneumatically-driven pump to an amplifier output of a dispensing system, and driving the solenoid coil with the amplifier to a cause the pneumatically-driven pump to dispense material on a substrate. The method further may include commanding an idle current to flow in the solenoid coil during periods of inactivity. The idle current may be sufficient to cause warming of the solenoid coil, yet not sufficient to activate the solenoid to an engaged position. The method further may include commanding a first current level to flow in the solenoid coil to rapidly activate the solenoid, and commanding a second current level to flow in the solenoid coil after the solenoid is activated.
Method of manufacturing a flexible circuit electrode array
Polymer materials make useful materials as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision. Regardless of which polymer is used, the basic construction method is the same. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned by wet etch to create electrodes and leads for those electrodes. The base polymer layer is activated. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body.
GUIDED TRANSPORT PATH CORRECTION
A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.
SURFACE TREATMENT DEVICE
Disclosed is a surface treatment device. The surface treatment device includes: a frame; a disc hanger; two support wheels for supporting the disk hanger; a rotation drive mechanism for driving the disk hanger supported on the two support wheels to rotate; a vertical spray rack for spraying liquid medicine on the circuit board on the disk hanger; and a lift mechanism for driving the vertical spray rack up and down.
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.
Enclosure with tamper respondent sensor
A method to fabricate a tamper respondent assembly is provided. The tamper respondent assembly includes an electronic component and an enclosure at least partly enclosing the electronic component. A piezoelectric sensor is integrated in the enclosure. The integrating includes providing a base structure that includes a first conductive layer, depositing a piezoelectric layer on the first conductive layer, covering the piezoelectric layer with a second conductive layer, and providing sensing circuitry for observing sensing signals of the piezoelectric layer. The piezoelectric layer includes a plurality of nanorods. Aspects of the invention further relates to a corresponding assembly and a corresponding computer program product.
Guided transport path correction
A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.