A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

Described herein are methods for forming resistive heaters and force sensing elements on a flexible substrate, and devices that include these elements to provide a force responsive conductive heater, such as a seat heater in a vehicle. The methods include printing a conductive ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The conductive inks generally include a particle-free metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material.

Provided are an electronic component manufacturing method by which even a platable layer made of a difficult-to-plate material can be easily plated with good adhesion without using a special chemical solution or a photolithography technique, and an electronic component which has a peel strength of 0.1 N/mm or greater as measured by a copper foil peel test. A picosecond laser beam having a pulse duration on the order of a picosecond or a femtosecond laser beam having a pulse duration on the order of a femtosecond is emitted at a surface of a platable layer (2) in order to roughen the surface, a wiring pattern is formed using a mask (13), and a plated part (12) is formed on the surface of the wiring pattern.

Described herein are molecular inks, methods for printing the molecular inks on flexible substrates, and methods for forming printed electronic elements, such as resistive heaters, force sensors, motion sensors, and devices that include these elements, such as force responsive conductive heaters. The methods include printing a molecular ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The molecular inks generally include a particle-fee metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material, and/or surfactant.

The present invention discloses a method for coating and forming a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid film on a copper foil; (2) delivering the same to a tunnel oven for roasting, and forming a cured film on the copper foil to obtain a single-sided board; (3) coating a layer of synthetic liquid high-frequency material on the cured film; and (4) delivering the same to the tunnel oven for roasting until the synthetic liquid high-frequency material layer becomes a semi-cured high-frequency material layer so as to obtain a novel material layer structure of a high-frequency circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to make a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to circuit board preparation and simplifies the process.

A substrate (1, 10) for electrical circuits, comprising at least one metal layer (2,3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2,3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a, 6a, 6b, 6b) to the metal layer (2,3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a, 6a, 6b,6b).

A display device includes a substrate having a flat portion, a first curved portion adjacent to a side of the flat portion, and a second curved portion adjacent to a corner of the flat portion and the first curved portion, and a display unit on the substrate, the display unit including a plurality of display pieces on the second curved portion of the substrate, the display pieces being spaced apart from each other, and extending from the corner of the flat portion to an edge of the second curved portion.

The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an aluminium layer (4) attached thereon, wherein at least the surface side of the aluminium layer (4) facing away from the copper layer (3) is anodized for the generation of an anodic or insulating layer (5) made of aluminium oxide, and wherein the anodic or insulating layer (5) made of aluminium oxide is connected to a metal layer (7) or at least one second composite layer (2) or at least one paper-ceramic layer (11) via at least one adhesive layer (6, 6).

Provided are an electronic component manufacturing method by which even a platable layer made of a difficult-to-plate material can be easily plated with good adhesion without using a special chemical solution or a photolithography technique, and an electronic component which has a peel strength of 0.1 N/mm or greater as measured by a copper foil peel test. A picosecond laser beam having a pulse duration on the order of a picosecond or a femtosecond laser beam having a pulse duration on the order of a femtosecond is emitted at a surface of a platable layer (2) in order to roughen the surface, a wiring pattern is formed using a mask (13), and a plated part (12) is formed on the surface of the wiring pattern.

The present invention provides a ceramic circuit board comprising: a ceramic substrate; and at least one of a recess and a through-hole formed in the ceramic substrate, wherein a conductive portion filled with a conductor is provided in the recess or the through-hole, the surface roughness Ra is 1.0 m or less, and the maximum height Rz is 100 m or less. It is preferable that the maximum height Rz is 10 m or less. Further, it is preferable that the surface roughness Ra is 0.5 m or less. According to the above-described configuration, it is possible to provide a ceramic circuit board having an excellent positionability of the conductive portion for mounting a semiconductor element.