An electronic module includes a three-dimensional wiring board including a cavity portion in which a bottom surface and four wall surfaces are formed, a plurality of electrodes being provided on the bottom surface, and a plurality of electronic components mounted on the plurality of electrodes and including a plurality of chip components and an image pickup module configured to pick up an image in an opening section direction of the cavity portion. A wall surface among the four wall surfaces that corresponds to a direction in which the plurality of chip components are arrayed is an inclined surface having an inclination with respect to the bottom surface.

A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.

A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.

An example sensor includes a PCB mounted in an internal chamber of housing, wherein the PCB comprises calibration electrical contact points; a sealing grommet mounted in the internal chamber, wherein the sealing grommet comprises an axial hole aligned with the calibration electrical contact points, thereby providing access to the calibration electrical contact points of the PCB; a grommet plug disposed in the axial hole of the sealing grommet; a sensing element disposed in the housing and electrically-coupled to the PCB via an electrical connection; an encapsulant sealing material deposited on the sealing grommet and the grommet plug; and an external cable connected to the PCB and extending through the sealing grommet and through the encapsulant sealing material.

An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical component has a conductive structure on both ends of the electrical component. The electrical component is substantially parallel to the first surface. The method may include forming a laminate layer on the first surface of the base layer, the second surface of the base layer, and between the base layer and the electrical component. The method may include creating a pair of via holes, where the pair of holes align with the conductive structures on both ends of the electrical component. The method may include forming a conductive via in the pair of via holes.

A method of controlling a dispensing unit is used to dispense material on a substrate. The method includes connecting a solenoid coil of a pneumatically-driven pump to an amplifier output of a dispensing system, and driving the solenoid coil with the amplifier to a cause the pneumatically-driven pump to dispense material on a substrate. The method further may include commanding an idle current to flow in the solenoid coil during periods of inactivity. The idle current may be sufficient to cause warming of the solenoid coil, yet not sufficient to activate the solenoid to an engaged position. The method further may include commanding a first current level to flow in the solenoid coil to rapidly activate the solenoid, and commanding a second current level to flow in the solenoid coil after the solenoid is activated.

Provided is a liquid metal-based flexible electronic device and a method for preparing a liquid metal-based flexible electronic device, that includes: preparing an Acrylonitrile Butadiene Styrene (ABS) plastic model; performing an ion sputtering on a surface of the ABS plastic model to form a gold film, to obtain a gold-plated ABS circuit; introducing a first silica gel into a mold to suspend the gold-plated ABS circuit inside the mold, and curing the first silica gel to obtain a cured model; immersing the cured model in acetone to dissolve the ABS model, to obtain a microchannel with a gold plating on an inner wall of the microchannel in a first silica gel substrate; and injecting a gallium-indium eutectic, inserting a copper wire, and applying a second silica gel and curing the second silica gel, to obtain the liquid metal-based flexible electronic device.

A case with connector includes a connector; a case body that has a cylindrical side wall portion and an end wall portion closing one end side of the side wall portion and forming an accommodation portion along with the side wall portion, the case body being formed by insert molding and integrated with the connector at the side wall portion; and an electrical wire that has an end connected to the connector and the other end projecting to the accommodation portion.

A power module includes: a carrier with a surface; a plurality of power elements and a plurality of external connectors provided on the carrier; a grounded shielding member positioned above the power elements for shielding the electro-magnetic interference of the power elements; an encapsulation layer covering the carrier, the power elements, the shielding member and at least part of the external connectors. A method for manufacturing a power module and an inverter is also provided.

Object: A plurality of problems of an electromagnetic wave transmissive cover to be installed in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave are simultaneously eliminated. Resolution means: An electromagnetic wave transmissive cover 1 is a member to be installed in an electromagnetic wave irradiation direction of a millimeter wave radar 100 using an electromagnetic wave, and includes a colored resin member 3, a transparent resin member 5, and a transparent heater film 7. The transparent resin member 5 is provided on an opposite side to the millimeter wave radar 100 of the colored resin member 3. The transparent heater film 7 is provided on the opposite side to the millimeter wave radar 100 of the colored resin member 3, includes a wiring pattern formed by copper plating or etching, and has electromagnetic wave transmissivity.