The invention is directed to a metal core substrate having high thermal conductivity and high electrical insulating properties; an electrophoretic deposition fluid for use in fabrication of the metal core substrate; and a method for fabricating the metal core substrate. The electrophoretic deposition fluid is used during electrophoretic deposition, and contains ceramic particles for coating a metal substrate, and an organopolysiloxane composition which binds the ceramic particles.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

This present disclosure generally relates to systems and methods of electrophoretic deposition (EPD) techniques for use in insulation systems at least partially encapsulating a semiconductor device, a conductive component and a substrate, such as insulation systems of semiconductor devices, busbars, or the like. Insulation systems formed using EPD processes may be designed to have a dielectric constant that decreases in a direction away from a substrate of the insulation system. This may improve insulation technologies since depositing coatings with sequentially arranged dielectric constants may improve resistance of the insulation system to high temperature, high electric fields, or the like.

This present disclosure generally relates to systems and methods of electrophoretic deposition (EPD) techniques for use in insulation systems at least partially encapsulating a semiconductor device, a conductive component and a substrate, such as insulation systems of semiconductor devices, busbars, or the like. Insulation systems formed using EPD processes may be designed to have a dielectric constant that decreases in a direction away from a substrate of the insulation system. This may improve insulation technologies since depositing coatings with sequentially arranged dielectric constants may improve resistance of the insulation system to high temperature, high electric fields, or the like.

A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.