Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

A method of manufacturing a treated sheet includes preparing a resin layer composite including a resin sheet and a thermoplastic resin layer supported on one surface of the resin sheet, applying a dispersion liquid including a powdery thermoplastic resin raw material onto a surface of the thermoplastic resin layer opposite to the resin sheet, and fusing the thermoplastic resin raw material to the thermoplastic resin layer by irradiating, with light from a flash lamp, a coating of the thermoplastic resin raw material formed in the applying step. The thermoplastic resin raw material has a melting point higher than the glass transition point of a resin that is a primary material of the resin sheet.

A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

A light source module includes a light source for emitting light, and a heat sink for absorbing heat from the light source and dissipating the heat to the outside. The heat sink includes a mounting part for attaching the light source, and a heat dissipation fin for absorbing heat generated by the light source and dissipating the heat to the outside. An electrical insulating layer is provided on at least one surface of the heat sink, and an electrically conductive layer is provided in the insulating layer. The electrically conductive layer provides a path through which electric current is applied to the light source. A lens cover is provided over the light source.

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, an electrical insulating part provided on the heat sink, and a plating part provided on the insulating part. The plating part includes a contact heat dissipation part contacting a portion of a bottom surface of the light source to receive heat generated from the light source, and a diffusion heat dissipation part connected to the contact heat dissipation part for receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed.

Electrically isolating an electrical or electronic assembly having a carrier and one or more electrical or electronic components mechanically and electrically connected with the carrier, includes coating the carrier or at least one of the components or both entirely or partially with powder. The powder includes powder particles of electrically isolating material that have an average particle diameter of less than 1000 micrometers.

Electrically isolating an electrical or electronic assembly having a carrier and one or more electrical or electronic components mechanically and electrically connected with the carrier, includes coating the carrier or at least one of the components or both entirely or partially with powder. The powder includes powder particles of electrically isolating material that have an average particle diameter of less than 1000 micrometers.