The elastomeric electrode includes: a stretchable substrate 10 having wrinkles formed on one surface thereof, the peaks C and valleys T of the wrinkles being repeated; a wrinkled metal nanoparticle layer 20 including metal nanoparticles 21 and formed by deposition of the metal nanoparticles along the wrinkles of the substrate 10; and a wrinkled monomolecular layer 30 including a monomolecular material having one or more amine groups (—NH.sub.2) and formed by deposition of the monomolecular material onto the metal nanoparticle layer 20. Also disclosed is a method for preparing the elastomeric electrode.

A method of potting e.g. a stack of printed circuit boards, the method comprising applying a first potting material to selected regions of the circuit to be potted and then applying a second, different, potting material over the circuit to be potted.

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder. The printed circuit board further includes a coating film (31) that is disposed at least on a front end side of the connection portion (23a) than a portion where the second electrodes (19 and 25) are joined to the first electrodes (7 and 9) by the solder.

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10.sup.−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10.sup.−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

A method of manufacturing an implantable stimulation device includes providing a circuit board of the implantable stimulation device, the circuit board being equipped with circuit components and an antenna, adhering one or more electrodes to the circuit board, and applying an insulation material to the circuit board such that the insulation material forms a housing that surrounds the circuit board, the circuit components, and the antenna, while leaving the one or more electrodes exposed for stimulating a tissue.

The elastomeric electrode includes: a stretchable substrate 10 having wrinkles formed on one surface thereof, the peaks C and valleys T of the wrinkles being repeated; a wrinkled metal nanoparticle layer 20 including metal nanoparticles 21 and formed by deposition of the metal nanoparticles along the wrinkles of the substrate 10; and a wrinkled monomolecular layer 30 including a monomolecular material having one or more amine groups (—NH.sub.2) and formed by deposition of the monomolecular material onto the metal nanoparticle layer 20. Also disclosed is a method for preparing the elastomeric electrode.

There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder. The printed circuit board further includes a coating film (31) that is disposed at least on a front end side of the connection portion (23a) than a portion where the second electrodes (19 and 25) are joined to the first electrodes (7 and 9) by the solder.

A method of manufacturing an implantable stimulation device includes providing a circuit board of the implantable stimulation device, the circuit board being equipped with circuit components and an antenna, adhering one or more electrodes to the circuit board, and applying an insulation material to the circuit board such that the insulation material forms a housing that surrounds the circuit board, the circuit components, and the antenna, while leaving the one or more electrodes exposed for stimulating a tissue.