A method for producing a wiring circuit board includes a first step, a second step, and a third step. In the first step, while a work film which is a long metal substrate having a first surface and a second surface opposite to the first surface is fed and wound by a roll-to-roll method, a composition containing a photosensitive resin is applied onto the first surface to form an insulating film, and a protective film is interposed between the second surface and the insulating film of the work film in being wound. In the second step, while the work film having undergone the first step is fed and wound by the roll-to-roll method, the protective film is peeled from the insulating film, and the insulating film is subjected to light exposure treatment to be formed with a latent image pattern. In a third step, the insulating film having undergone the second step is subjected to development treatment to be patterned.

A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.

An insulating sheet for use in forming an insulating layer of an interconnect substrate includes a semi-cured insulating resin layer, a semi-cured protective resin layer laminated on an upper surface of the insulating resin layer, and a cover layer laminated on an upper surface of the protective resin layer, wherein the protective resin layer has lower resistance to a predetermined solution than the insulating resin layer has, the predetermined solution being capable of dissolving the insulating resin layer and/or the protective resin layer.

Provided are a liner and a display device including the same. The liner includes a first liner including a first shield can protection portion, a first grip portion, and a connection portion coupling the first shield can protection portion to the first grip portion, a second liner including a second shield can protection portion and a second grip portion, and a perforated line formed along a boundary between the first liner and the second shield can protection portion.

A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.

A process for efficiently producing a wiring board in which an insulating substrate 1 having a through hole 2 is used, which includes forming a seed layer 3 on one surface of the insulating substrate 1, covering the surface of the insulating substrate 1 on which the seed layer 3 is formed with a masking film 4, arranging the insulating substrate 1 and a positive electrode 5 so that the surface of the insulating substrate 1 opposite to the surface of the insulating substrate 1 on which the seed layer 3 of the insulating substrate 1 is formed is faced to the positive electrode 5, carrying out electroplating to form a metal layer 8 in the through hole 2, and then removing the masking film 4.

An insulating sheet for use in forming an insulating layer of an interconnect substrate includes a semi-cured insulating resin layer, a semi-cured protective resin layer laminated on an upper surface of the insulating resin layer, and a cover layer laminated on an upper surface of the protective resin layer, wherein the protective resin layer has lower resistance to a predetermined solution than the insulating resin layer has, the predetermined solution being capable of dissolving the insulating resin layer and/or the protective resin layer.

A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.

A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.

Provided is a method of producing a shielded printed wiring board capable of sufficiently adhering to each other a printed wiring board, an adhesive layer of an electromagnetic wave shielding film on one face of the printed wiring board, and an adhesive layer of an electromagnetic wave shielding film on the other face of the printed wiring board. The method of producing a shielded printed wiring board of the present invention includes a printed wiring board preparing step of preparing a printed wiring board including a base film, a printed circuit formed on the base film, and a coverlay covering the printed circuit; a first electromagnetic wave shielding film preparing step of preparing a first electromagnetic wave shielding film sequentially including a first protective film, a first insulating layer, and a first adhesive layer; a second electromagnetic wave shielding film preparing step of preparing a second electromagnetic wave shielding film sequentially including a second protective film, a second insulating layer, and a second adhesive layer; a first electromagnetic wave shielding film placing step of placing the first electromagnetic wave shielding film on the printed wiring board so that the first adhesive layer is in contact with one face of the printed wiring board, and part of the first adhesive layer protrudes from an end of the printed wiring board to form a first extending end portion; a second electromagnetic wave shielding film placing step of placing the second electromagnetic wave shielding film on the printed wiring board so that the second adhesive layer is in contact with the other face of the printed wiring board, and part of the second adhesive layer protrudes from an end of the printed wiring board to form a second extending end portion; a stacking step of stacking the first extending end portion on the second extending end portion so that a gap is created between the first extending end portion and the second extending end portion, whereby a shielded printed wiring board before pre-pressing is prepared; a pre-pressing step of pressurizing and heating the shielded printed wiring board before pre-pressing to the extent that the first adhesive layer and the second adhesive layer are not completely cured, whereby a pre-pressed shielded printed wiring board is prepared; a protective film peeling step of peeling off the first protective film and the second protective film from the pre-pressed shielded printed wiring board, whereby a shielded printed wiring board before post-pressing is prepared; and a post-pressing step of pressurizing and heating the shielded printed wiring board before post-pressing to cure the first adhesive layer and