A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

One embodiment of the present disclosure provides a system for determining a hybrid-manufacturing plan for manufacturing an integrated circuit (IC). During operation, the system can obtain a set of hybrid-manufacturing constraints for manufacturing the IC. The set of hybrid-manufacturing constraints can include a set of primitives, a set of atoms, and an atom end-state vector. An atom can correspond to a unit of spatial volume of the IC. A primitive can represent an additive, subtractive, or a mixed manufacturing process corresponding to one or more atoms of the IC. Next, the system can determine a plurality of feasible hybrid-manufacturing plans based on the set of manufacturing constraints. Each feasible hybrid-manufacturing plan can represent an ordering of the set of primitives that satisfies the atom end-state vector. The system can then determine costs for manufacturing the IC using the plurality feasible hybrid-manufacturing plans. The system can determine, based on the costs, an optimized hybrid-manufacturing plan for manufacturing the IC.

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

The present invention discloses a surface tension driven flexible electronics transfer printing method which uses a surfactant liquid membrane or a surfactant bubble as a transfer printing stamp, to realize the transfer printing of an electronic device with nanometer/micron/submillimeter thickness. A process of transfer printing is transparent and visible in a what you see is what you get manner to realize the accurate positioning of the electronic device. A local load technology is introduced, which is suitable for arbitrary complex curved substrate to realize diverse transfer printing. The electronic device can be transfer-printed to an application substrate with extremely-low interfacial adhesion, without the requirement for the strong and weak adhesion switching strategy of the traditional transfer printing. An unbearable electronic device membrane can be transfer-printed to an fragile receiving substrate with no loss or low loss, without the introduction of pre-pressure.

A method for copper filling-up of blind vias in HDI rigid-flex PCB is provided which includes the steps of: 1) performing a copper reduction on a single side of a double sided copper-clad laminate; 2) drilling blind vias with inverted trapezoidal shape in a side of the double sided copper-clad laminate being copper reduced by laser; 3) cleaning via walls and the via bottoms of the blind vias to remove the residues left during the drilling process; 4) depositing metallic copper layers on surfaces of the via walls and the via bottoms of the blind vias; 5) filling the blind vias with copper after the blind vias being deposited by metallic copper layer. The copper filling-up of the blind vias in the HDI rigid-flex PCB is achieved, leading to decreased cost of equipment investment and improved production efficiency and benefits.

Discussed generally herein are methods and devices for altering an effective series resistance (ESR) of a component. A device can include a substrate including electrical connection circuitry therein, a first via hole through a first surface of the substrate and contiguous with the electrical connection circuitry, a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole, and a component electrically coupled to the first conductive polymer.

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

Discussed generally herein are methods and devices for altering an effective series resistance (ESR) of a component. A device can include a substrate including electrical connection circuitry therein, a first via hole through a first surface of the substrate and contiguous with the electrical connection circuitry, a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole, and a component electrically coupled to the first conductive polymer.