Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

The present invention provides a method for detecting and adjusting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. This is accomplished, by after detecting poor back drills in a PCB, measuring the actual thickness of each PCB board. Next, the measured actual thickness of each PCB board is compared with .the theoretical thickness of each PCB board. The back drill depth for each area of the PCB board is then adjusted for its theoretical thickness and percent variation from the measured thickness.to adjust the poor back drill.

A secondary detection system for integrating automated optical inspection and neural network and a method thereof are disclosed. In the secondary detection system, an automated optical inspection apparatus performs automated optical inspection for pin solder joints on circuit board, and when a detection result indicates abnormal condition, the secondary detection device calculates a detection image probability value based on the component image feature and the template image feature, and calculate pin solder joint image probability values based on the component pin solder joint image feature and the template pin solder joint image feature through siamese neural network, to obtain a minimum probability value among the detection image probability value and pin solder joint image probability values. The minimum probability value is used to determine whether to change the detection result, thereby providing accurate detection result of automated optical inspection and increasing a first pass yield.

A screen mask inspection device inspects a screen mask including a screen opening that forms a printing pattern, and includes: an inspection control device that detects solder position information of a solder paste printed on a substrate via the screen opening, and based on the solder position information, determines whether a quality of printing using the screen mask is good or bad, the solder position information being based on an amount of positional misalignment of the solder paste actually printed on the substrate relative to a predetermined reference position.

A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

Provided is a method for manufacturing a flexible film. The method for the manufacturing the flexible film includes providing a parent film on which a plurality of film areas are defined, each of which having a detection pattern formed thereon, applying a voltage to each of the film areas to detect whether a defect exists, removing the detection pattern from respective ones of the film areas on which the defect is detected, and cutting out others of the film areas on which the defect is not detected.

A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.

There is described a method of assessing an ink deposition accuracy in an electronic device printing process. The method generally has: printing a meta material structure on a substrate using conductive ink, the metamaterial structure having a pattern of conductive elements interspersed with complementary insulating elements, the metamaterial structure having at least a terahertz resonance frequency; emitting a terahertz radiation beam incident on the metamaterial structure of the substrate, the incident terahertz radiation beam having power at least at the terahertz resonance frequency of the metamaterial structure; the metamaterial structure interacting with said incident terahertz radiation beam resulting in an outgoing terahertz radiation beam having a spectral response at least at the terahertz resonance frequency; measuring said spectral response of said outgoing terahertz radiation beam; assessing an ink deposition accuracy of said printing based on said measured spectral response; and generating a signal based on said assessed ink deposition accuracy.

A screen printer that measures a tension of a mask in a machine, including a mask holding device configured to hold a mask; a board device configured to position a board from below with respect to the mask held by the mask holding device; a squeegee device configured to apply and spread a cream solder on an upper surface of the mask; a mask pressing device configured to press the mask at a set pressure by a pusher which is installed on an upper travelling device or a lower travelling device with respect to the mask; a mask measurement device, installed on the upper travelling device or the lower travelling device to be opposed to the pusher, which is configured to measure a height of the mask; and a tension measurement device configured to calculate a tension of the mask based on a measured value of the mask measurement device.