Technologies are described for shielding electronic components. In one embodiment, a conductive gasket includes a gasket body. A conductive shield has a plurality of projections extending therefrom sufficient to deform the gasket body to couple the conductive shield and the conductive gasket together. The projections can be pointed teeth designed for penetrating the conductive gasket so as to electrically and mechanically couple the conductive shield to the conductive gasket. The conductive gasket can be stacked onto the conductive shield to form a sidewall, which can be mounted on a PCB. A conductive cover can then be placed on the conductive gasket to create a cavity in which electronic components can be positioned.

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

Methods for refurbishing a circuitry device are disclosed. The methods described herein include applying a first flux to solder contacts connecting a first member of a circuitry device to a second member of the circuitry device; performing a first setting process on the circuitry device with the first flux; applying a second flux to the solder contacts of the circuitry device; performing a second setting process on the circuitry device; and reflowing the solder contacts.

A bending apparatus includes a first height control part which ascends in a first direction and descends in a direction opposite to the first direction, a second height control part spaced apart from the first height control part in a second direction crossing the first direction, and which ascends in the first direction and descends in the direction opposite to the first direction, a first rotation part attached to the first height control part, and which rotates with respect to a rotation axis, a second rotation part attached to the second height control part, and which rotates with respect to the rotation axis, and a supporting part disposed between the first and second rotation parts, where a first end of the supporting part is attached to the first rotation part, and a second end of the supporting part is attached to the second rotation part.

Technologies are described for shielding electronic components. In one embodiment, a conductive gasket includes a gasket body. A conductive shield has a plurality of projections extending therefrom sufficient to deform the gasket body to couple the conductive shield and the conductive gasket together. The projections can be pointed teeth designed for penetrating the conductive gasket so as to electrically and mechanically couple the conductive shield to the conductive gasket. The conductive gasket can be stacked onto the conductive shield to form a sidewall, which can be mounted on a PCB. A conductive cover can then be placed on the conductive gasket to create a cavity in which electronic components can be positioned.

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

Methods for refurbishing a circuitry device are disclosed. The methods described herein include applying a first flux to solder contacts connecting a first member of a circuitry device to a second member of the circuitry device; performing a first setting process on the circuitry device with the first flux; applying a second flux to the solder contacts of the circuitry device; performing a second setting process on the circuitry device; and reflowing the solder contacts.

The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level embodiments of transient electronics are provided.

The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.