An arrangement arranged to enclose a circuit board comprising electronic components is described. The arrangement comprises a structure designed to receive the circuit board and the electronic components, a housing designed to receive the structure, a cover designed to be connected to the housing, and an electric socket adapted to provide the circuit board with electricity. The electric socket is comprised in at least one of the housing or the cover. The arrangement is arranged to enclose the circuit board by the housing and the cover, wherein the structure is designed to be releasable and at least partly bear against the circuit board and the electronic components. A tool comprising an arrangement is also described.

Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

A reel for the purpose of winding a length of cable of optical fiber cable type includes a winding support for winding the length of cable, a retaining part suitable for retaining the length of cable wound around the winding support, a first attachment part for the purpose of attaching the reel to an edge of a circuit board such that the reel is positioned laterally with respect to the circuit board, and a second attachment part for the purpose of attaching the reel flat to a face of the circuit board.

Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

A control unit for an apparatus, the control unit comprising: a component-carrying member provided with at least one electronic component configured to provide a function of the apparatus; wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit; and a laminate encapsulation layer encapsulating at least a part of the or each electronic component. Optionally, the control unit comprises a second member which defines a user-interaction surface.

Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

Reel for the purpose of winding a length of cable of optical fiber cable type, comprising: a winding support (12) for winding the length of cable; retaining means suitable for retaining the length of cable wound around the winding support; first attachment means for the purpose of attaching the reel to an edge of a circuit board (50) such that the reel is positioned laterally with respect to the circuit board; second attachment means for the purpose of attaching the reel flat to a face of the circuit board.

System comprising a circuit board and a reel.

Method for assembling an electrical device.

A control unit (10) for an apparatus (12), the control unit (10) comprising a component-carrying member (14; 114; 18; 118) provided with at least one electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78) configured to provide a function of the apparatus (12); wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit (10). The control unit is provided with an injection moulded layer (22; 22) encapsulating at least a part of the or each electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78).

A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.

Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.