A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.

Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

A release film on a printed circuit board and a connector connected to the printed circuit board includes a first release film disposed on a first surface of the printed circuit board and a surface of the connector, a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board, and a first adhesive attached to a portion of a surface of the first release film that does not overlap the second release film, extending towards the second release film and covering a portion of a surface of the second release film that does not face the first release film.

Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.

Circuit boards and computer-implemented methods for designing circuit boards are disclosed. In one embodiment, a method of designing a circuit board having an insulator substrate includes determining, by a computer, a plurality of thermal conductor traces that is arranged to direct heat flux generated by a heat generating component away from a temperature sensitive component, and determining a plurality of electrical connection traces based on an input schematic. At least a portion of the plurality of electrical connection traces incorporate at least a portion of the plurality of thermal conductor traces to define a conductive trace pattern that electrically connects pins of two or more components located on the substrate. The conductive trace pattern includes the plurality of thermal conductor traces and the plurality of electrical connection traces. Disruption of the plurality of thermal conductor traces is avoided while determining the plurality of electrical connection traces.

A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

An apparatus, system and method of providing a tray suitable for holding an optoelectronic device during printed circuit board manufacturing processes. The apparatus, system and method includes a tray body having an inset for receiving the optoelectronic device; a plurality of positioners for the optoelectronic device within the inset; and a guide channel about a perimeter of the tray body suitable for receiving optical fibers of the optoelectronic device when the optoelectronic device is received in the inset, the guide channel comprising at least one retainer for retaining received ones of the optical fibers therewithin.

A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.

A control unit (10) for an apparatus (12), the control unit (10) comprising a component-carrying member (14; 114; 18; 118) provided with at least one electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78) configured to provide a function of the apparatus (12); wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit (10). The control unit is provided with an injection moulded layer (22; 22′) encapsulating at least a part of the or each electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78).

A screen-printing screen for printing electrically conductive patterns on glass sheets, includes a main mask, the aperture size of the main mask being larger in a lateral portion than in the central portion, the screen furthermore including, in at least one double-mask zone, located in the central portion, at least one secondary mask fastened to a face of the main mask, the aperture size of the or each secondary mask being larger than the aperture size of the main mask in the central portion, and the mesh of the or each secondary mask making, with the mesh of the main mask, an angle α comprised between 1 and 89°.