A device includes a porous substrate that include a plurality of pores and a plurality of nanodevices dispersed in at least a portion of the plurality of pores. Each of the plurality of nanodevices includes a magnetic nanowire and a solder nanoparticle. The magnetic nanowires are configured to generate heat in response to an alternating magnetic field. The solder nanoparticles are configured to receive a portion of the heat and reflow to connect to one or more devices or surfaces.

A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.

Provided is a method for manufacturing an LCP film for a circuit substrate capable of achieving an LCP film for a circuit substrate having a low coefficient of linear thermal expansion and excellent dimensional stability, without excessively impairing excellent basic performance possessed by the liquid crystal polyester, such as mechanical characteristics, electrical characteristics, and heat resistance. The method for manufacturing an LCP film for a circuit substrate at least comprising: a composition provision step of providing an LCP resin composition at least containing 100 parts by mass of a liquid crystal polyester and 1 to 20 parts by mass of a polyarylate; a film forming step of T-die melt-extruding the LCP resin composition to form a T-die melt-extruded LCP film having a coefficient of linear thermal expansion (α2) in a TD direction of 50 ppm/K or more; and a pressurizing and heating step of subjecting the T-die melt-extruded LCP film to pressure and heat treatment to obtain an LCP film for a circuit substrate having a coefficient of linear thermal expansion (α2) in the TD direction of 16.8±12 ppm/K.

The disclosure provides a portable light. The portable light includes a housing having a front surface, a rear surface, and an internal space for receiving electronic components and a battery. The portable light also includes a chip-on-board (COB) assembly. The COB assembly includes a substrate, a matrix of individual light emitting diode (LED) chips mounted to the substrate, and an outer coating covering the matrix of LED chips. The front surface of the housing is curved in one direction and the COB assembly is correspondingly curved and mounted to the front surface, such that individual LED chips are positioned about the curve and orientated to direct light outwardly about the curve to provide a collective beam angle greater than 220 degrees. The portable light further includes a front lens cover to protect the COB assembly.

A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.

To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.

Please replace the Abstract with the following: In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.