A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.

A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film. The transparent insulating layer and the cover film are stacked along a stacking direction. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the transparent insulating layer. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board. The present invention also provides a method for manufacturing the transparent circuit board.

A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer, a second metal layer and a release layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The release layer is bonded on the first modified surface. The second insulating substrate is bonded on a side of the release layer, such that the release layer is between the first modified surface and the second insulating substrate. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the release layer and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the release layer.

An all-directions embedded module includes a substrate layer, many first embedded pads, many second embedded pads, and many side wall circuits. The substrate layer comprises a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connected to the first surface and the second surface. The first embedded pads is formed on the first surface. The second embedded pads is formed on the second surface. The side wall circuits embedded in the substrate layer and exposed from the side surfaces. The all-directions embedded module further includes a plurality of first connecting circuits formed on the first surface and a plurality of second connecting circuits formed on the second surface. The first embedded pads is connected to the side wall circuits by the first connecting circuits. The second embedded pads is connected to the side wall circuits by the second connecting circuits.

Electronics modules according to embodiments of the present technology may include a circuit board having a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the first surface. The modules may also include an overmold at least partially encapsulating the circuit board. The overmold may be characterized by a first height extending normal to the first surface of the circuit board across the width of the circuit board. The overmold may extend laterally beyond the width along a length of the first surface. The overmold may define a region about the tie-bar residual characterized by a recessed height. The overmold may define a notch recessed from an outer edge of the overmold. The notch may be located across the tie-bar residual.

A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

The present application relates to the technical field of circuit board fabricating, and provides a method for fabricating an asymmetric board, the method includes fabricating a master board, fabricating a second sub-board, thermal compression bonding the master board and the second sub-board, and milling a finished board; further includes at least one of the following three steps: laying copper on the connection positions of the master board except for the second copper layer of an outermost layer to obtain laying copper area, digging copper on the connection positions of the third copper layer, and after the step of milling the finished board, on each of the impositions, performing depth control milling at the connection positions from a side of the second sub-board on each imposition to obtain a depth control groove.

The present disclosure relates to a multilayer circuit board manufacturing apparatus. The present disclosure includes: uncoiler configured to provide a member; a process unit configured to perform a process on the member provided from the uncoiler; a recoiler configured to wind the member on which the process is completed in the process unit; and a tension adjustment unit which is located in at least one of the uncoiler, the recoiler, a region between the uncoiler and the process unit, and a region between the process unit and the recoiler, and adjusts tension of the member.

A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.

A printed circuit board includes: a first multilayer substrate including first and second vias adjacent to each other in a stacking direction of the printed circuit board; a second multilayer substrate disposed on the first multilayer substrate in the stacking direction and including third and fourth vias adjacent to each other in the stacking direction; and an adhesive layer connecting respective one surfaces of the first and second multilayer substrates to each other. Each of the first to fourth vias has one surface and the other surface facing the one surface, the one surface being closer to the adhesive layer than the other surface, and the one surface having a larger transverse cross-sectional area than the other surface.