Patent classifications
H05K5/0026
HANGING GROUNDED STRUCTURE
A hanging grounded structure is disclosed and includes a housing, a recessed portion and a hanging groove. The housing includes an opening facing a first direction and a lateral wall extended along a second direction. The lateral wall has a top edge located at a periphery of the opening. The recessed portion is recessed inwardly on the lateral wall. The hanging groove is disposed on the lateral wall and located in the recessed portion. A grounded wire is hung on the housing through the hanging groove. The hanging groove includes a starting point located at the top edge and an ending point. A curved path is formed from the starting point to the ending point. The grounded wire is hung from an interior of the housing. An end of the grounded wire is disposed in the recessed portion through the hanging groove.
Electronic unit
An electronic unit includes a first board and a second board which are stacked on each other, a first connector mounted on a surface of the first board which faces the second board, and a second connector mounted on a surface of the second board which faces the first board. Each of the first connector and the second connector has a fitting portion and a lock portion configured to lock a fitting of the fitting portion. The fitting portion and the lock portion of the first connector are provided between the first board and the second board in a stack direction in which the first board and the second board are stacked. The fitting portion and the lock portion of the second connector are provided between the first board and the second board in the stack direction.
Electronic device architecture and components
An electronic device can include a housing at least partially defining an internal volume and an exterior surface of the electronic device. The electronic device can also include a display assembly including a display layer, a substrate disposed below the display layer, and a substantially continuous sheet of conductive material disposed on the substrate, the sheet of conductive material covering substantially an entire surface of the substrate. A transparent cover can overlie the display assembly and can be affixed to the housing.
MANAGED CONNECTIVITY IN ELECTRICAL SYSTEMS AND METHODS THEREOF
An electrical connector arrangement includes a storage device coupled to a connector housing. The storage device is configured to store physical layer information pertaining to the electrical connector arrangement. The storage device also has contacts that enable the physical layer information to be read from the storage device by a media reading interface. A connector assembly includes at least one receptacle assembly; a printed circuit board; and a media reading interface.
ELECTRONIC DEVICE HAVING SUBMERSION DETECTION CIRCUIT, OPERATING METHOD THEREOF, AND STEER-BY-WIRE STEERING DEVICE INCLUDING THE SAME
An electronic device includes a circuit board having a signal detection terminal disposed on a first surface thereof and a ground terminal disposed on a second surface thereof and extending vertically so that the first surface and the second surface face each other in a horizontal direction, a monitoring terminal connected with the signal detection terminal, and a microcontroller unit (MCU) determining whether there is submersion by monitoring a voltage at the monitoring terminal. According to the present embodiments, it is possible to prevent hypersensitivity-induced misdetection due to condensation and dew. It is also possible to stepwise respond to submersion and determine whether the monitoring circuit normally operates to precisely detect submersion.
Vehicle control device and vehicle control system
A signal processing IC unit performs image processing with respect to an output from a camera. A recognition processing IC unit performs recognition processing based on the output from the signal processing IC unit. A control IC unit outputs a control signal based on the output from the recognition processing IC unit. A first terminal is electrically connected to the recognition processing IC unit. A second terminal is electrically connected to the control IC unit. The signal processing IC unit, the recognition processing IC unit, and the control IC unit are disposed on a board. The first terminal and the second terminal are provided on an edge portion of the board.
MODULAR MEMORY DEVICES
The present application provides a memory device. The memory device includes a connector plate having a front edge and a rear edge opposite to the front edge, wherein the connector plate comprises an edge connector disposed at the rear edge and configured to connect to a host connector of a host device; a controller plate defining a first connection region, a second connection region and a chip region, wherein the controller plate is attached to the connector plate at the first connection region, and the controller plate comprises a memory control module disposed in the chip region and in electrical communication with the edge connector; and at least one memory module detachably connected to the controller plate at the second connection region of the controller plate, wherein each of the at least one memory module is in electrical communication with the memory control module when the memory module is connected to the controller plate, such that the memory module can be accessible by the host device via the memory control module.
ELECTRONIC DEVICE
An electronic device includes a housing sidewall defining an opening and a display component, such as a display cover, disposed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is defined by the sidewall and the display cover with the cavity in fluid communication with an external environment through the gap. In at least one example, an epoxy component at least partially defines the cavity and can be in direct contact with the housing sidewall.
Sensor module
Disclosed herein is a sensor module that includes a substrate having a top surface and a back surface, a sensor element mounted on the top surface of the substrate, an external terminal formed on the back surface of the substrate, and a case fixed to the substrate so as to cover the sensor element. The case has a top plate part having a plurality of through holes. The top plate part has a center area having no through holes and a through hole formation area having the plurality of through holes, the through hole formation area being positioned so as to surround the center area.
INITIATOR HEAD WITH CIRCUIT BOARD
An initiator head may include a housing extending in an axial direction, a circuit board provided in an interior space of the housing, a line-in terminal provided on a first side of the housing in the axial direction and accessible from an exterior of the housing, and a fuse displaced from the circuit board in the axial direction. A thickness direction of the circuit board may be substantially parallel with the axial direction. The line-in terminal may be in electrical communication with the circuit board. The fuse may be in electrical communication with the circuit board. The circuit board may be configured to activate the fuse in response to a control signal received at the line-in terminal.