An apparatus comprises a housing, a component cradle, and a plurality of towers. The housing generally has an inner mounting surface. The component cradle may be formed on the inner mounting surface of the housing. The plurality of towers may be formed on and extending from the inner mounting surface of the housing around the component cradle. The towers are generally deformable into a form-fitting engagement with an electronic component placed on the component cradle.

An electronic device calculates a temperature index value of a temperature of a housing surface by using a temperature sensor and calculates a prediction reached value from change of the temperature index value. The electronic device calculates a rate parameter indicating a target of a decrease rate for decreasing the prediction reached value, on the basis of the prediction reached value calculated at a certain time point and a threshold value. The electronic device controls a clock frequency of a processor on the basis of the calculated rate parameter and correspondence information that associates a plurality of target values of the prediction reached value and a plurality of clock frequencies of the processor.

An electronic device packaging box includes a base and a terminal unit. The base includes a first space having a first opening and receiving a first coil, and second space having a second opening opposite to the first opening and receiving a second coil. The base has first and third side surfaces proximate to the first opening, and second and fourth side surfaces proximate to the second opening. The terminal unit has two first connecting sections protruding from the second side surface, two second connecting sections protruding from the third side surface, two first wire connecting sections protruding from the first side surface, and two second wire connecting sections protruding from the fourth side surface.

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.

The invention specifies an electronic component which has a first electrode (10), a second electrode (20), an active region (30), which is electrically coupled to the first electrode (10) and to the second electrode (20), and a housing (100), wherein the housing (100) contains carbon layers which are monoatomic at least in subregions.

An element-accommodating package which can improve frequency characteristics of an element-accommodating package having a coaxial connector, and a mounting structure are provided. An element-accommodating package includes a metallic substrate, a frame, a first coaxial connector, a second coaxial connector, and a circuit board. A groove is provided between one side of the frame and a side surface of the circuit board and between a first signal line and a second signal line.

A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

An electronic device packaging box includes a first base, a second base and a connecting unit. The first base includes two side walls spaced apart from each other in a first direction and each having a first side receiving space, and a connecting wall interconnecting the side walls to define a receiving space. The second base is received in the receiving space, and includes spaced-apart top and bottom walls, and a separating wall interconnecting the top and bottom walls to define two second side receiving spaces. The connecting unit includes two first connecting subunits, each of which is mounted to a respective one of the side walls, and two second connecting subunits, which are mounted to the bottom wall.

One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.

A capacitor carrier assembly includes a carrier, a capacitor disposed in the carrier and electrically conductive connection terminals that support the carrier with respect to another electronic component or device such as a printed circuit board. Each connection terminal has a body portion that is electrically connected to one capacitor lead of the pair of capacitor leads at a connection location, and a device connection portion that protrudes from the carrier. Leads of the capacitor and the connection locations are encapsulated by wall structures of the carrier.