The TIC environmental event sensor is a nickel-sized, ultra-thin circuit assembly, containing an extremely compact array of both environmental sensors and physical sensors, along with local and wireless access to all the sensor data, including BTLE & LoRa, as well as an electronic ink display for limited field access to sensor events in real time. The TIC is designed to capture changes in the sensor data in real time, and then log it for future examination. The most recent change will remain on the device’s display. The changes can then be transmitted to a smart phone or tablet via BTLE, networked as an asset via LoRa, or locally scrolled at the device. The TIC is Ideal for tracking any variations in the surrounding conditions of an asset’s travel, storage, or use.

A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

An electronic device includes a housing assembly and a receiver assembly. The housing assembly includes a first housing and a second housing. The first housing defines an accommodating space. The receiver assembly is received in the accommodating space. The receiver assembly includes a receiver, a circuit board, and a conducting member. The conducting member is electrically connected to the receiver and the circuit board. The second housing is connected to the first housing and the conducting member.

A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360° allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together.

An electronic device is provided. The electronic device includes a device body provided with an accommodation space and an opening communicated with the accommodation space, a function module having a first state and a second state, and an ejecting mechanism including a connecting rod, a slider detachably connected to the function module, a driving member, and a guide rail that is disposed on the slider. The driving member is disposed in the accommodation space, a first end of the connecting rod is hinged to the device body, a second end of the connecting rod slides along the guide rail, and the slider is configured to switch between a first position and a second position.

Enclosure parts for portable information handling systems may be made by heat pressing material layers together. The material layers may include outer fiber-reinforced thermoplastic layers and a core thermoplastic layer comprising a plurality of thermoplastic film layers. The core thermoplastic layer may be die cut to create voids that reduce weight of the enclosure part. A finishing layer may be added, along with attachment features.

Embodiments of the present disclosure generally relate to housings and enclosures for electronic devices and memory devices, and more specifically to such housings and enclosures having nickel-boron coatings and processes for forming such nickel-boron coatings. In an embodiment is provided an article for housing at least a portion of an electronic device that includes a metal-containing substrate, and a layer comprising nickel and boron, the layer disposed on at least a portion of the metal-containing substrate, wherein: an amount of nickel in the layer is about 95 wt % or more and an amount of boron in the layer is about 5 wt % or less based on the total amount of nickel and boron in the layer. The article has a thermal conductivity of about 25 W/mK or more, a scratch hardness of about 0.5 GPa or more, a coefficient of friction of about 0.4 or less, or combinations thereof.

A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360° allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together.

In a communication apparatus, an analog circuit includes a circuit element to be connected to a first conductor, and processes a differential signal. A communication circuit receives, via a connection circuit, a differential signal processed by the analog circuit, and generates a signal for which the potential of a second conductor is used as a reference potential based on the received differential signal. An inductor is connected between the first conductor and the second conductor. The connection circuit includes a circuit element different from a capacitor. The analog circuit (21), the connection circuit, the communication circuit, the inductor, the first conductor, and the second conductor are housed in a conductive housing box.

Embodiments described herein provide methods of processing an electronic component, comprising mixing a bio-based polymer having sulfur-reactive substituents with a sulfurization catalyst and a solvent to form a coating material; applying the coating material to an electronic component; and removing the solvent to form a sulfur-reactive polymer coating that is resistant to sulfur penetration. The bio-based polymer may be made by bacterial fermentation of unsaturated fatty acids.