In one aspect, thermal management units are described herein which, in some embodiments, offer one or more advantages compared to other units for managing or controlling thermal energy. In particular, units and systems described herein incorporate one or more phase change materials (PCMs), such as one or more PCMs having a certain phase transition temperature, latent heat, and/or phase transition type. The PCMs are contained in equipment housing with the application of various components to provide management or controlling of thermal energy.

Provided is a heat dissipation structure, including a conductive member disposed on and thermally coupled to a heat source, a heat pipe including evaporating and condensing parts, a fan disposed in correspondence to the condensing part, and a heat storage component disposed on a circuit board. The evaporating part is disposed on and thermally coupled to the conductive member. The heat source is located between the conductive member and the circuit board. The conductive member is located between the heat pipe and the heat source. The circuit board is located between the heat source and the heat storage component, and is thermally coupled to the heat source. The heat storage component is thermally coupled to the circuit board and is filled with a working medium absorbing heat conducted from the heat source to the circuit board by latent heat of absorption during phase change. An electronic device is also provided.

A user device that can be touched by a user includes a heat source that can generate heat; a case body covering the heat source; and a polymer-containing heat storage body attached to the case body.

Systems associated with device temperature adjustment are described. A device temperature adjustment system can include an electronic device having a temperature sensor integrated therein to detect a temperature of the electronic device and a temperature adjust module coupled to the electronic device to adjust a temperature of the electronic device based on the detected temperature.

An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (“PCM”) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.

The object of the invention is a system for regulating the temperature of particularly a server room, where the premises are equipped with an air-conditioning unit. The object of the invention, furthermore, is an application intended to operate the foregoing system, where an external primary circuit, an internal secondary circuit and an air-conditioning unit is operated during the operation of the system. The system according to the invention is characterized in that it furthermore includes a cooling array complete with a thermal regenerator that includes a cooling array complete with a thermal regenerator (T1) that includes an external primary circuit and an internal secondary circuit; where the external primary circuit is primed with a primary transmitting medium which may be circulated with a first fluid machinery, expediently a primary pump (P1), and passes through a primary heat exchanger (H1) unit located outside the premises; the internal secondary circuit is primed with a secondary transmitting medium which may be circulated with a second fluid machinery, expediently a secondary pump (P2), and passes through a secondary heat exchanger (H2) unit located inside the premises; and the external primary circuit and the internal secondary circuit can be controlled independently of each other, by a model suitable for control. The application according to the invention is characterized in that during the operation of the system, the following operating modes alternate: free cooling, case 1 according to the HV model, case 2 according to the HV model or case 3 according to the HV model.

A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

A cooling device comprises a first casing for direct mounting on a heat-generating component and a second casing mounted on the first casing. One casing includes an internal channel connected to a cold inlet and to a hot outlet allowing a heat-transfer fluid to flow in the internal channel. The other casing includes a storage containing a phase change material (PCM) changing from a solid state to a liquid state to transfer thermal energy from the heat-generating unit to the PCM, the PCM changing from the liquid state to the solid state to transfer thermal energy from the PCM to the heat-transfer fluid. The cooling device may be integrated in a cooling circuit of a cooling system including an external cooling unit, or in a closed loop cooling circuit of a cooling arrangement that transfers heat from the closed loop to an open loop.

A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.