A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

Embodiments of the present invention are directed to systems, devices, lockable enclosures, and methods for data centers. In one example, a lockable enclosure for a data drive is provided. The lockable enclosure includes a housing configured to retain a first data drive and a latch contained within the housing and configured to receive a second data drive, wherein the latch is configured to move within the housing for dispensing the first data drive from the housing while the second data drive remains secured therein.

An electronic equipment assembly has an interconnect including columns of signal conductors, connectors mounted to the columns of signal conductors, and a chassis coupled with the interconnect. The chassis provides slots that guide resource devices into engagement with the connectors mounted to the columns of signal conductors to enable the interconnect to electronically access the resource devices. At least one column of the columns of signal conductors of the interconnect is a multi-function column. Each multi-function column is constructed and arranged to electronically access different types of resource devices through a respective connector mounted to that multi-function column.

An electronic equipment assembly has an interconnect including columns of signal conductors, connectors mounted to the columns of signal conductors, and a chassis coupled with the interconnect. The chassis provides slots that guide resource devices into engagement with the connectors mounted to the columns of signal conductors to enable the interconnect to electronically access the resource devices. At least one column of the columns of signal conductors of the interconnect is a multi-function column. Each multi-function column is constructed and arranged to electronically access different types of resource devices through a respective connector mounted to that multi-function column.

A card connector, a card holder, and a terminal device, where the card connector includes a plurality of first terminals and one or more second terminals. The first terminals are arranged to form a first card access area that installs a first card, and the first terminals are configured to be electrically coupled to the first card. The one or more second terminals are distributed on a periphery of the first card access area, the first terminals and the one or more second terminals form a second card access area that installs a second card, and the first terminals and the one or more second terminals are configured to be electrically coupled to the second card.

Embodiments of the present invention are directed to systems, devices, lockable enclosures, and methods for data centers. In one example, a lockable enclosure for a data drive is provided. The lockable enclosure includes a housing configured to retain a first data drive and a latch contained within the housing and configured to receive a second data drive, wherein the latch is configured to move within the housing for dispensing the first data drive from the housing while the second data drive remains secured therein.

A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

An expansion module for a computing unit of a High-Performance Computer cabinet, the expansion module comprising a casing configured to be removably guided horizontally in a main housing of a computing unit of a High-Performance Computer cabinet, a support card, mounted within the casing, comprising at least one module connector, said module connector being configured to be removably connected to the computing unit, a plurality of card slots connectors, each card slot connector being configured to be removably connected to an expansion card, at least a lever for locking/unlocking the casing to the main housing of the computing unit, said lever being operable manually without using any tools and a handle, pivotable according to a vertical axis, configured for locking/unlocking simultaneously the expansion cards when mounted in the card slot connectors.

A server system comprises a base, a front panel (13) arranged on the base and defining a collecting space; two doors (16) arranged on opposite sides of the base, and being perpendicular to the front panel; two storage cases (171) arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two first corridors are each defined between one of the doors and one of the storage case facing the one door; two circuit boards (18) arranged between the two storage cases, wherein the two circuit boards comprise a plurality of slits, wherein a second corridor is defined between the two circuit boards; a storage cover (121) disposed above the base over the two first corridors, the second corridor, the two storage cases, and the two circuit boards.

Example implementations relate to a compute node having a chassis with front installed trays. The chassis includes a base, a pair of walls, each coupled to a peripheral side of the base, and a first top cover portion coupled to the pair of walls to cover a portion of the chassis. The compute node further includes a plurality of first latches coupled to a rear end inner surface of the first top cover portion. The plurality of trays is slidable from a front side of the chassis and at least one tray is fastened to at least one first latch. Each tray includes a front cover, a floor coupled to the front cover, a pair of brackets coupled to the floor, a pair of risers, where each riser is coupled to a respective bracket, and a pair of GPU card assemblies, where each GPU card assembly is plugged to a respective riser.