[Problem] To provide: a roll-bonded body which is able to be suppressed in waviness in the surface; and a method for producing this roll-bonded body. [Solution] A roll-bonded body according to the present invention is obtained by bonding a first metal layer and a second metal layer with each other by means of rolling, and is characterized in that the surface of the first metal layer has an arithmetic average waviness (Wa.sub.1) 0.01-0.96 and a maximum waviness height (Wz.sub.1) of 0.2-5.0 μm.

There is disclosed a mobile terminal including a case comprising an electric control unit in which electronic components are loaded; a display unit coupled to a front surface of the case; a frame coupled to the case and supporting a rear surface of the display unit, the frame comprising a metallic material; a mainboard loaded in the case; a drive chip loaded in the mainboard; a shield can covering components loaded in the mainboard, the shied comprising a hole formed, corresponding to the drive chip; a thermal conductivity sheet comprising one surface in contact with a top surface of the drive chip and the other surface in contact with an inner surface of the frame; and a flexible material insertedly filling in a space formed between the thermal conductivity sheet and the frame, so that the heat generated in the drive chip of the mobile terminal may be effectively emitted and that only the portion of the mobile terminal, where the drive chip is loaded, may be prevented from being heated when the user is using the mobile terminal and the other components may be prevented from being damaged by the heat.

A casing component according to an embodiment of the present technology includes a decorating film and a casing part. The decorating film is formed on a base film by vapor deposition and includes a metal layer, fine cracks being formed in the metal layer by stretching the base film. The casing part has a decorated region, the decorating film being adhered to the decorated region.

A casing component according to an embodiment of the present technology includes a decorating film and a casing part. The decorating film is formed on a base film by vapor deposition and includes a metal layer, fine cracks being formed in the metal layer by stretching the base film. The casing part has a decorated region, the decorating film being adhered to the decorated region.

According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

An electronic device frame and an electronic device including the electronic device frame are provided. According to certain example embodiments, the electronic device frame may include a support member. The support member may include a surface area within a predetermined depth from a surface, and a core area corresponding to an area other than the surface area. The surface area may include a planar portion and a plurality of concave portions. An oxide film may be formed on a surface of the support member, and an amount of silicon in the surface area may be less than an amount of silicon in the core area. In addition, various other example embodiments are possible.

A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.

An electronic device including a speaker is provided. The electronic device includes a main housing, a cover housing connected to the main housing, a speaker provided inside the main housing and the cover housing, and a guide including a guide base seated on the main housing to support the speaker and a guide body extending from the guide base in a first direction and overlapping the speaker in a second direction perpendicular to the first direction.

An electronic device including a speaker is provided. The electronic device includes a main housing, a cover housing connected to the main housing, a speaker provided inside the main housing and the cover housing, and a guide including a guide base seated on the main housing to support the speaker and a guide body extending from the guide base in a first direction and overlapping the speaker in a second direction perpendicular to the first direction.