Patent classifications
H05K5/065
WEARABLE DEVICE
A wearable device is provided. The wearable device includes an electronic component and an encapsulant. The encapsulant includes a low-penetrability region encapsulating the electronic component and a high-penetrability region physically separated from the electronic component.
SUBMERSIBLE CONTROL PANEL
A submersible control system with a control panel. The control panel has a frame to house electronic components. The frame has a connection opening for wiring required for an electrical connection to the electrical components. An outer door is attached to the frame to be water-tight to the frame in a closed position thereof. A conduit is sealed to be water-tight with respect to the connection opening. The conduit is filled with an epoxy for water-tight sealing an interior of the conduit to the wiring fed through the conduit. The control panel will remain water-tight for at least 24 hours after being submerged.
CORONA PREVENTION IN HIGH POWER CIRCULATORS
A circuit assembly includes a sealable enclosure and at least one electronic circuit element contained within the sealable enclosure. The at least one electronic circuit element includes a control circuit, a garnet, and a first polymer material applied on a surface of the control circuit and on a surface of the garnet. A second polymer material fills a remaining space defined within the enclosure, the second polymer material applied on an exposed surface of the first material.
Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts
Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.
Method and tool for molding an electronic module, and molded electronic module
A method may include coating an electronic module in a tool, where the electronic module has a first sub-module and a second sub-module, where the tool has a first tool part and a second tool part, where the tool has a cavity at least partially formed between the first tool part and the second tool part, and where the first sub-module and the second sub-module are supported on the tool and held in the cavity at a spatially defined distance relative to one another in a contactless manner during the coating process. A tool for performing such method may include a first tool part and a second tool part that form a cavity, where the first tool part has a first molding surface section and at least one first supporting section that extends over the first molding surface section and the second tool part has a second molding surface section and at least one second supporting section that extends over the second molding surface section.
Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component
A sensor component for a transmission of a motor vehicle is provided. The sensor component includes a printed circuit board having a first printed circuit board region and a second printed circuit board region. The first printed circuit board region is delimited from the second printed circuit board region by a milled groove and is angled with respect to the second printed circuit board region along the milled groove. A sensor, such as a magnetoresistive sensor or a Hall sensor, is arranged in or on the first printed circuit board region. A pre-assembly arrangement and a method for producing such a sensor component are also provided.
ENCAPSULATION ASSEMBLY FOR GLASS, ENCAPSULATED GLASS AND MANUFACTURING METHOD THEREOF
An encapsulation assembly includes a body located at edges of the functional glass; and a conductive module embedded in the body or located on a surface of the body, and electrically connected to a functional module on the functional glass. The process of forming an encapsulated glass from the encapsulation assembly for a functional glass can omit complicated manufacturing steps and save materials and thus reduce costs. An easy and stable control of the functional module in the glass can also be accomplished. Moreover, it is much easier to form an encapsulated glass from the glass, which facilitates glass mounting.
Electronic control module and method for producing an electronic control module
An electronic control module, particularly for a transmission, includes a first circuit board element and a sensor unit carrier fastened to the first circuit board element. The sensor unit carrier has a sensor unit receptacle configured to receive a sensor unit. The sensor unit has a sensor element fastened and electrically connected to a second circuit board element so as to detect at least one measured value. The sensor unit is fastened in the sensor unit receptacle. The second circuit board element has a flexible region that separates a first sub-region of the second circuit board element from a second sub-region of the second circuit board element. The first sub-region has a predetermined angle to the second sub-region. The sensor element is electrically connected to the first circuit board element by the second sub-region of the second circuit board element.
Case having inner space within cover for electronic device
A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.
ELECTRICAL CONNECTION DEVICE WITH IMPERMEABLE MATERIAL
The connection device for connecting two electric units, including a case in which are arranged: an electric wire to be linked to the first unit and including a conductive core encircled by an insulating sheath and a conductive tab to be linked to the second unit and secured with the stripped end of the conductive core, all of which being immersed in a sealing material filling the case and bonded to the insulating sheath, the device including an intermediate envelope partially coating the insulating sheath, so that it is in contact with the sealing material only over a reduced portion, where the intermediate envelope is in sliding contact with the sealing material and/or the insulating sheath.