A splicing structure includes a support frame and a plurality of splicing modules. The support frame includes a frame base and an adjustment assembly movably disposed on the frame base, where the adjustment assembly includes a first adjustment structure and a second adjustment structure that move in different directions. A splicing module of the plurality of splicing modules is configured to be detachably connected with a corresponding to-be-spliced structure, where the splicing module is movably disposed on one of the first adjustment structure and the second adjustment structure, while the other one of the first adjustment structure and the second adjustment structure has a driving state and a non-driving state. When the other one of the first adjustment structure and the second adjustment structure moves, touches, and pushes the splicing module, the other one of the first adjustment structure and the second adjusting structure is switched from the non-driving state to the driving state.

A display device comprises a display area, a non-display area surrounding the display area, pixels disposed in the display area of the substrate, each of the pixels including a first electrode, a second electrode, and light-emitting elements electrically connected to the first electrode and the second electrode, and a first voltage wiring disposed in the display area and the non-display area, the first voltage wiring electrically connected to at least some of the pixels. The first voltage wiring includes a first separation wiring disposed in the non-display area, and a second separation wiring disposed in the non-display area and spaced apart from the first separation wiring.

A light emitting element ink and a method of manufacturing a display device are provided. The light emitting element ink includes a light emitting element solvent, a light emitting element dispersed in the light emitting element solvent, the light emitting element including a plurality of semiconductor layers and an insulating film surrounding outer surfaces of the semiconductor layers, a thickener dispersed in the light emitting element solvent, wherein a compound of the thickener includes a functional group capable of forming a hydrogen bond together with a compound of the light emitting element solvent or another compound of the thickener and the compound of the thickener is represented by Chemical Formula 1.

A light emitting element and a display device including the same are provided. The light emitting element includes: a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer; a passivation layer surrounding an outer surface of at least one selected from the first semiconductor layer, the second semiconductor layer, and the active layer; and an insulation layer surrounding an outer surface of the passivation layer, wherein the passivation layer includes a two-dimensional (2D) material.

A display device and a method of fabricating a display device. The display device includes a substrate including an emission area and a subarea adjacent to the emission area, a bank disposed in the emission area of the substrate, a height difference compensation pattern disposed in the subarea of the substrate, a first electrode and a second electrode that are disposed on the bank, the first electrode and the second electrode being spaced apart from each other, and a light-emitting element disposed in the emission area, between the first electrode and the second electrode.

Disclosed are an electronic device housing including a casing and a seal, and an electronic device. The casing has an interior provided with an accommodating cavity configured to accommodate electronic device components, and a casing wall provided with a mounting cavity configured to mount the seal. The casing includes first and second through holes. The first and second through holes communicates the mounting cavity with the accommodating cavity and an outside, respectively. The seal includes a sealing part and a fixing part connected thereto. The fixing part is fixed to the casing wall, and the sealing part blocks the first through hole. The sealing part has elasticity. When pressure in the accommodating cavity is greater than that of the outside, at least part of the sealing part is separated from the first through hole, such that the accommodating cavity communicates with the mounting cavity to communicate with the outside.

Provided are an ink composition, a light-emitting apparatus using the ink composition, and a method of manufacturing the light-emitting apparatus. The ink composition may include a light-emitting device, a solvent, and an organic thickener, and the organic thickener is a polymeric compound including at least one group represented by Formula 1: ##STR00001## wherein in Formula 1, X, R.sub.1, n1, and R.sub.2 may respectively be understood by referring to the descriptions of X, R.sub.1, n1, and R.sub.2 provided in the detailed description.

The present disclosure has an object to hinder reduction of a yield due to a failure in an LED element or a mounting failure in a self light emitting apparatus. In a self light emitting apparatus, each pixel includes one basic cell and at least one redundant cell as a subpixel. The redundant cell includes an LED element that emits light of a color the same as at least one LED element out of LED elements included in the basic cell. A plurality of subpixels included in each pixel are configured as a subpixel group being an assembly that includes a plurality of LED elements being integrated. An array pitch of the subpixels in the subpixel group is smaller than an array pitch of the subpixels in adjacent ones of a plurality of subpixel groups.

A method for fabricating epitaxial light control features, without reactive ion etching or wet etching, when active layers are included. The epitaxial light control features comprise light extraction or guiding structures integrated on an epitaxial layer of a light emitting device such as a light emitting diode. The light extraction or guiding structures are fabricated on the epitaxial layer using an epitaxial lateral overgrowth (ELO) technique. The epitaxial light control features can have many different shapes and can be fabricated with standard processing techniques, making them highly manufacturable at costs similar to standard processing techniques.

A solid-state device includes a substrate with a stack of constituent thin-film layers that define an arrangement of electrodes and intervening layers. The constituent layers can conform to or follow a non-planar surface of the substrate, thereby providing a 3-D non-planar geometry to the stack. Fabrication employs a common shadow mask moved between lateral positions offset from each other to sequentially form at least some of the layers in the stack, whereby layers with a similar function (e.g., anode, cathode, etc.) can be electrically connected together at respective edge regions. Wiring layers can be coupled to the edge regions for making electrical connection to the respective subset of layers, thereby simplifying the fabrication process. By appropriate selection and deposition of the constituent layers, the multi-layer device can be configured as an energy storage device, an electro-optic device, a sensing device, or any other solid-state device.