A kit for manufacturing electronic aircraft control units having different specifications, the units including electronic modules of different types, including avionics platform modules comprising at least an electronic monitoring circuit and an electronic control circuit that are segregated from each other; first protection modules for protecting the avionics platform modules; first extended connection modules; and second protection modules for protecting the extended connection modules; the modules of each type being identical with one another.

A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.

An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that tend to alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems.

The invention discloses electrical equipment, an integrated circuit's loop thereof and a circuit connecting method. The integrated circuit's loop includes: a passive component part, including a power device and/or an execution device; and one or more electrical components, each of the electrical components including a body and multiple pins, wherein at least one pin extends to an electrical connecting end of the passive component part, and is electrically connected with the electrical connecting end. In the integrated circuit's loop of the invention, the pins of the electrical components extend to electrical connecting ends of the passive component part, and are electrically connected with the electrical connecting ends, so that the electrical components are not required to be arranged on a Printed Circuit Board (PCB), a physical structure of the circuit configuration is simplified, a size of the circuit is reduced, and the technician is not required to design the PCB.

An automobile architecture includes a composite cable, a main electronic control unit, a subsidiary electronic control unit, a motor sensor, and a wheel velocity sensor. In the architecture, the composite cable connects the main electronic control unit and the subsidiary electronic control unit, and the motor sensor and the wheel velocity sensor are connected to the subsidiary electronic control unit.

A power converter arrangement includes a semiconductor switch system with a controllable switch. A capacitor unit includes a capacitor having a capacitance value, the capacitor unit being operatively connected to the semiconductor switch system. A conductor arrangement includes a conductor adapted to conduct an electric current between the capacitor unit and the semiconductor switch system. The conductor has a resistance and an inductance. A resonant circuit is formed by the resistance, the inductance and the capacitance, and the power converter arrangement includes at least one attenuating element for attenuating an electrical ringing in the resonant circuit. The attenuating element is conductively isolated from the resonant circuit. The attenuating element includes ferromagnetic material, and the attenuating element is magnetically coupled to the conductor such that variations in the electric current intensity of the conductor induces eddy currents within the attenuating element.

A connection structure of a thin film electrode and a housing includes at least one thin film electrode unit and a housing; the electrode unit includes a porous thin film, a first electrode and a second electrode attached to two sides of the film; a part of the film and a part of the first electrode form a first electrical connection unit; a part of the film and a part of the second electrode form a second electrical connection unit; at least one installation groove is provided on the inner wall surface of the housing; the electrode unit is provided in the installation groove; at least one communication unit communicated with the installation groove is further provided on the outer wall surface of the housing; the first electrical connection unit and the second electrical connection unit are respectively communicated with an external circuit of the housing through the communication unit.

Embodiments include smart jumper cables for jump-starting a vehicle. A jumper cable is configured with an electronic control module that monitors the connection at each end of the jumper cable, and only closes the circuit when a battery or vehicle electrical system is detected as properly connected to each end. In some embodiments, the electronic control module opens the circuit when a successful jump-start is detected. In some embodiments, the electronic control module further monitors the temperature of the jumper cable, and modulates the power transfer or opens the circuit if the temperature exceeds a predetermined level.

The present invention discloses a modularized circuit for isolated circuit, wherein the isolated circuit includes at least two circuit components connecting in parallel and/or series, the circuit components, according to a circuit connection configuration, weld corresponding pins of the components directly, forming an integrated module in accordance with a desired connection method of the circuit, and saving circuit boards and wires; the circuit components are designed as a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped. Due to constructing a circuit unit by welding connections in a way of building blocks, welding directly between components in a 3D space, comparing to the circuits limited in a circuit board plane as a PCB, it owns a wider design space.