An equipment enclosure (1) for electromagnetically isolating an electronic device, the equipment enclosure 1 comprising a conductive housing (3) and a plurality of conductive sheets (5). Each sheet (5) includes an aperture (7). The sheets (5) are stacked in a spaced-apart relationship within the housing (3) thereby defining a plurality of electromagnetically-isolated cavities (9) each within a respective Faraday cage formed by the conductive housing (3) and the conductive sheets (5). The apertures (7) form a channel (11) that extends through the enclosure (1) providing a route for connections between the cavities (9).

Disclosed is a circuit assembly having a novel structure that enables circuit components to be laid out in a lower case with high design flexibility and higher spatial efficiency. A circuit assembly includes: a lower case for accommodating lower circuit components; an upper case for covering the lower case; upper circuit components attached to the upper case, and a fastening member holder for holding a fastening member for fixing the upper circuit components to the upper case, the fastening member holder being provided in the upper case.

Disclosed is a circuit assembly having a novel structure that enables circuit components to be laid out in a lower case with high design flexibility and higher spatial efficiency. A circuit assembly includes: a lower case for accommodating lower circuit components; an upper case for covering the lower case; upper circuit components attached to the upper case, and a fastening member holder for holding a fastening member for fixing the upper circuit components to the upper case, the fastening member holder being provided in the upper case.

This uninterruptible power supply device includes an input module provided with a plurality of conductor wires having a plate shape including at least a plurality of AC input wires, and an uninterruptible power supply module. In addition, the plurality of AC input wires each extend in an X direction in which the uninterruptible power supply module and the input module are adjacent to each other, and have AC input cable attachment portions in which an AC input cable is attached. The AC input cable attachment portions are disposed so as to be separated from each other in a Y direction, which is a direction in which a front side and a rear side of the input module face each other.

This uninterruptible power supply device includes an input module provided with a plurality of conductor wires having a plate shape including at least a plurality of AC input wires, and an uninterruptible power supply module. In addition, the plurality of AC input wires each extend in an X direction in which the uninterruptible power supply module and the input module are adjacent to each other, and have AC input cable attachment portions in which an AC input cable is attached. The AC input cable attachment portions are disposed so as to be separated from each other in a Y direction, which is a direction in which a front side and a rear side of the input module face each other.

A method of producing a semiconductor module arrangement includes providing a first subassembly having a number N1 of first adjustment openings, a second subassembly having a number N2 of second adjustment openings and a third subassembly having a plurality of adjustment pins which are fixedly connected to one another, the first subassembly, the second subassembly and the third subassembly being independent of one another and not connected to one another. The first subassembly, the second subassembly and the third subassembly are arranged relative to one another in such a way that each of the adjustment pins engages into one of the first adjustment openings and/or into one of the second adjustment openings.

A method of producing a semiconductor module arrangement includes providing a first subassembly having a number N1 of first adjustment openings, a second subassembly having a number N2 of second adjustment openings and a third subassembly having a plurality of adjustment pins which are fixedly connected to one another, the first subassembly, the second subassembly and the third subassembly being independent of one another and not connected to one another. The first subassembly, the second subassembly and the third subassembly are arranged relative to one another in such a way that each of the adjustment pins engages into one of the first adjustment openings and/or into one of the second adjustment openings.

An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.