A power converter includes a semiconductor unit, a capacitor unit, a first input connector, a second input connector, an output connector, a housing case, a first input bus bar connecting the first input connector and the semiconductor unit, a second input bus bar connecting the second input connector and the semiconductor unit, an output bus bar connecting the semiconductor unit and the output connector, and a bus bar connecting portion at which the first input bus bar and the second input bus bar are connected. The capacitor unit is arranged in a portion of the first input bus bar between the first input connector and the bus bar connecting portion.

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

The present disclosure provides a power module assembly and a converter. The power module assembly includes a power module and a capacitor module, and the power module and the capacitor module are configured to be detachably connected; the power module includes a first bus bar, and the first bus bar includes a first connection portion and a power installation portion connected to the first connection portion; the capacitor module includes a second bus bar, and the second bus bar includes a second connection portion and a capacitor installation portion connected to the second connection portion, wherein the first connection portion and the second connection portion extend along a first direction, and the power installation portion and the capacitor installation portion extend along a second direction; the first connection portion and the second connection portion are connected by a fastener.

An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.

A system that may include a rigid bus bar body portion having one or more first conductive pathways, and a flexible bus bar body portion extending from the rigid bus bar body portion and having a lower modulus of elasticity than the rigid bus bar body portion, the flexible bus bar body portion including one or more second conductive pathways. The one or more first conductive pathways and the one or more second conductive pathways may be configured to be conductively coupled with a first electronic device to form a conductive connection between the first electronic device and at least a second electronic device.

A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.

In a power converter, electronic components constituting a power conversion circuit is provided. A capacitor module and a converter case are also provided in the power converter. Fastening members, which include a first fastening member and a second fastening member, are configured to fasten the capacitor module to the converter case. The first and second fastening members are mounted on the inner bottom surface of the converter case. At least one of the electronic components is mounted to the capacitor module and is arranged between the first fastening member and the second fastening member when viewed in a view direction perpendicular to an alignment direction of the first and second fastening members. The view direction is parallel to the inner bottom surface of the converter case.

A modular rack system and method includes a rack having plural electrical interfaces, and plural module panels configured to mate with the electrical interfaces of the rack. The module panels have one or more of a common exterior size or a common exterior shape. At least two of the module panels have different internal electrical components configured to perform different operations. The rack is configured to be conductively coupled with a power delivery system of a vehicle and the module panels are configured to modify electric current prior to the electric current being supplied to the power delivery system of the vehicle.

A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

A power conversion apparatus includes: a semiconductor module including a built-in switching element; and a pair of bus bars connected to a power terminal of the semiconductor module. The pair of bus bars has body plate parts that are arranged so as to at least partially face each other in a thickness direction, and pluralities of terminal connection parts that are branched from the body plate parts and to which the power terminal is connected. At least one of the pair of bus bars has a plurality of annular parts that are annularly formed so as to include the plurality of terminal connection parts.