A high-voltage component for a high-voltage on-board electrical system of an at least partly electrically operated motor vehicle, including at least one housing device for at least one power electronics device of the high-voltage on-board electrical system, wherein the housing device at least partly provides at least one shielding device for reducing effects of electromagnetic interference, and wherein the shielding device includes at least one electrically non-conductive housing body of the housing device and at least one electrical discharge path arranged at least partly on and/or in the housing body and configured to connect to a vehicle reference potential.

An inverter casing and a connection structure of an inverter and a junction box are provided. The inverter casing includes an upper casing with an inner side that is provided with a cavity for accommodating a circuit board, and an upper surface that is provided with a junction recess for accommodating a junction box that is fixedly installed in the junction recess. Moreover, a bottom part of the junction recess is provided with an elastic protrusion for connecting a high-voltage protection device, and two incoming terminals. The elastic protrusion cooperates with a knockout pin on the junction box for high-voltage power-off protection, and the two incoming terminals are connected with external cables via the junction box.

A sub-module is disclosed. A sub-module according to an embodiment of the present invention comprises a short-circuiting control part. The short-circuiting control part comprises a movable member slidably coupled to a frame on which capacitor assemblies are seated. A variable connector is coupled to the movable member. Moreover, a plurality of short-circuiting blocks are arranged on the frame while being spaced away from each other. When the movable member has slid, the variable connector comes into contact with one or more short-circuiting blocks adjacent to each other to be electrically conductive. The short-circuiting blocks are connected to the capacitor assemblies, respectively, to be electrically conductive. Therefore, a plurality of capacitor elements can be short-circuited simultaneously only by moving the movable member.

A power electronics assembly for a power generation system includes a housing and an attenuator card positioned within the housing. The attenuator card may include at least one printed circuit board for a high-voltage attenuator circuit. The power electronics assembly also includes a potting material at least partially filling the housing on one or more sides of the attenuator card, a detachable end cap positioned at a first end of the housing, and multi-phase wiring communicatively coupled to the high-voltage attenuator circuit through the end cap.

The invention relates to a method for producing a power module (1) and a power module (1), in particular for a medium or high voltage converter (2), comprising at least one power semiconductor module (3), at least one energy storage module (5), at least one cooling device (7), at least two busbars (10), wherein the cooling device (7) is configured to be electrically conductive and is connected to a protective housing (19) shielding at least the power semiconductor module (3) from the environment, which protective housing (19) has at least one insertion opening (20) for inserting and fastening a connecting element (15), and an electrically conductive connecting element (15) is arranged at a predefinable connection position (16) between at least the cooling device (7) and one of the busbars (10) for forming a defined charge-reversal path (17).

An electrical service interface system include a configurable device and inverter mounted to an equipment tower, wherein each of the configurable device and inverter include alignment devices configured to rollably mount the configurable device and inverter to corresponding guides mounted to a support pad, and to align the configurable device to the inverter, and the inverter to the equipment tower. In an installed configuration, the configurable device electrically and mechanically couples to the inverter via a DC connector and one or more mounting systems, and the inverter mechanically and electrically couples to the equipment tower via an AC connector and one or more mounting systems.

An electrical module contains at least one electrical component which is accommodated in a module housing. The module housing has at least two housing parts which lie one on the other and, on their own or together with one or more further housing parts of the module housing, delimit the interior of the module housing. There is at least one adhesive layer between the two housing parts, the adhesive layer adhesively bonding the two housing parts to one another.

A sub-module cooling device of a power transmission system is proposed. Sub-modules may be arranged in a row on each of multiple layers of a frame. Heat generated by the sub-modules may be transferred to a duct through heat pipes, and the heat transferred through the heat pipes may be discharged to the outside while air coming out from an air conditioner passes through the duct. When the heat generated by the sub-modules is discharged in this manner, a cooling fan may not be required to be installed in each of the sub-modules. Air may be flown by the operation of the air conditioner and may absorb the heat generated by the sub-modules and discharge the heat to the outside.

The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).

A converter assembly includes a converter with converter valves, each having power semiconductor switches. At least one fluid-tight encapsulation housing, in which at least some of the power semiconductor switches are disposed, forms a modular converter unit. The encapsulation housing is at least partially filled with an electrically insulating insulation fluid in order to electrically insulate the power semiconductor switches disposed in the encapsulation housing.