A display apparatus includes a housing having a pillar shape, a plurality of monitors, and a driving unit received in the housing and providing driving signals to the plurality of monitors. Each of the plurality of monitors displays an image through its front surface and back surface and includes side surfaces connecting the front surface and the back surface. One side surface of the side surfaces of each of the plurality of monitors is coupled to the housing. A thickness of each of the plurality of monitors decreases as a distance from the housing increases.

The invention relates to A nose cone assembly for a munition, comprising a transducer array operably linked to a transmission assembly, wherein the transducer array is operably connected to a transducer housing, said transducer housing comprising a first and second surface, wherein said transmission assembly is reversibly operably connected to the second surface of said transducer housing, said transmission assembly comprising a control board and a plurality of electronic circuit boards, wherein at least one electronic circuit board is a transceiver circuit board, said electronic circuit boards being reversibly connected to the control board and being arranged along their longest dimension, at an axis substantially perpendicular to the control board and further arranged such that the electronic circuit boards extend radially inwardly to a substantially rotational centre of the control board.

Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

An electronic device includes an accommodation and an electronic module. The accommodation has an acceptor, a first connector, a second connector and an elastic. The elastic is between the first connector and the second connector. The second connector is on the acceptor. The first connector and the second connector have a bump and a track respectively. The first connector and the second connector are linearly relatively movable with the bump and the track. The electronic module connects to the acceptor. With a pre-designed path of the track, the electronic device allows the electronic module to be easily stored in the accommodation, and be taken out of the accommodation by a simple pressing action.

Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.

In accordance with at least one aspect of this disclosure, a thermal management system for an electronics assembly includes, a reservoir housing a compressible fluid in a compressed state, a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid, and a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice.

Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

A subsea container is for housing an electronic module. In an embodiment, the subsea container includes a main body including an opening; a module frame for receiving an electronic module that is to be arranged inside the main body; a support structure for supporting the module frame within the main body; and a lid fitting the opening of the main body, the support structure including a shock absorbing structure. Further, a method of manufacturing a subsea container is described.

A system is disclosed which utilizes a stabilization disk 30 or rigid cup containing adhesive which is bonded to an underside of a circuit board and then bolted to a chassis of a piece of military electronic equipment, so as to create a mounting location between the circuit board and the chassis where the circuit board is lacking a regular fastener receiving mounting hole therethrough.

An electronic system includes first and second circuit boards and a flexible circuit connector. The flexible circuit connector is configured to electrically connect the first and second circuit boards. The flexible circuit connector includes first and second connectors and a spiral portion. The first connector is configured to connect to the first circuit board. The second connector is configured to connect to the second circuit board. The spiral portion is connected between the first and second circuit boards and includes a circumferential portion that extends around the second connector.