Systems and methods for improved circuit board removal and/or reinstallation are provided. A circuit board removal system can include a frame including a channel arranged in a plate of the frame. A disengagement slider can include a mounting surface and a first portion including a first cam surface, where the disengagement slider is arranged within the frame. A separator can include a second cam surface and can be arranged in the channel of the plate. The first cam surface and the second cam surface can be nested with each other when the disengagement slider is in an inserted position. The disengagement slider can be configured to slide the separator in the longitudinal direction when the disengagement slider is removed from the frame due to the interaction of the first cam surface with the second cam surface.

Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methods are disclosed. An example back plate includes a ceramic substrate having a first surface and a second surface opposite the first surface. The example back plate further includes metal coupled to the ceramic substrate. At least a portion of the metal is disposed between planes defined by the first and second surfaces of the ceramic substrate.

A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track.

Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

A retention assembly includes a first retention member with a first set of ribs and a second set of ribs. The first set of ribs are positioned to form slots, which are shaped to receive data storage devices. The first set of ribs are arranged to separate adjacent data storage devices and have a first length. The second set of ribs extend into respective slots to form air channels within the slots, and the second set of ribs have a second length that is shorter than the first length.

A rack adapted for receiving a component, a system including the rack and the component and a method of delivering power to the component mounted in the rack are disclosed. The rack comprises a backplane, a power panel, and a main controller. Each stage of the backplane includes a backplane power connector and a backplane data connector that are respectively connectable to a component power connector and to a component data connector when the component is inserted in the backplane stage. The main controller detects an insertion of the component in a given backplane stage by receiving a signal emitted by the backplane data connector of that backplane stage, acquires a set of power parameters of the component, and causes the power panel to provide power to the backplane power connector of that backplane stage according to the set of power parameters of the component.

A PCB assembly is disclosed herein. An embodiment of the present disclosure provides a printed circuit board (PCB) assembly on which a plurality of devices is mounted, including: a power supply area disposed at one side of a main printed circuit board; a first area positioned in another direction of the main printed circuit board from the power supply area and including the plurality of devices; a second area positioned in another direction of the main printed circuit board from the first area and including the plurality of devices; a third area positioned in another direction of the main printed circuit board from the second area and including the plurality of devices; and a bridge printed circuit board receiving power from the power supply area and disposed vertically to the main printed circuit board, wherein the bridge printed circuit board crosses the first area, the second area, and the third area, and transmits power and a signal to at least one area.

Disclosed is a computer case with I/O panels on opposite sides of the case, and a method for providing the case. The case includes a top, a bottom, a back side that is opposite a front side, and a right side that is opposite a left side. The case also includes a front I/O opening formed in the front side that receives a front I/O panel. The computer case also includes a rear I/O opening in the back side that receives a rear I/O panel.

A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.

A system includes a support frame residing within a region conforming to a 3.5-inch form-factor disk drive specification, and a plurality of data storage drives, wherein each data storage drive resides entirely within the region. Each data storage drive conforms to a 2.5-inch form-factor disk drive specification, is mounted on the support frame via at least one external mounting hole that is positioned on a surface of the data storage drive in conformance with the 2.5-inch form-factor disk drive specification, is communicatively coupled to a backplane via an electrical connection device, and the electrical connection device includes a flexible electrical connector that, when coupled to a first end of the data storage drive, does not extend beyond the region, and has a removal tab through which a removal force is exerted to urge the data storage drive away from the support frame.