An electrical device, e.g., an inverter or converter, includes a first and a second printed circuit board. The first printed circuit board includes protruding tab regions, and a respective tab region protrudes into a respective recess of the second printed circuit board. Contact pins, e.g., of one or more plug connector parts, protrude into holes of the second printed circuit board.

Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

A circuit board assembly includes a circuit board and an electrical connector having a connector housing holding contacts in a contact array. The connector housing has a mating end configured to be mated with a mating electrical connector in a mating direction. The electrical connector has cables terminated to the contacts and extending from a cable end. A connector mount is used to locate the electrical connector relative to the circuit board. A bracket is coupled to the mounting surface of the circuit board. A biasing member is coupled to the bracket and the mounting feature and is compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board.

Methods and apparatus for an assembly including a circuit card coupled to an alignment bracket having a bracket mounting hole with an interposer board having a front and back connectors and a mounting hole. The front connector is mated with the circuit card and the back connector is configured and positioned to mate with a test connector of a unit under test (UUT). An alignment plate has a plate mounting hole. First and second alignment pins may be rotatably engaged to position the connectors in relation to the alignment plate.

Apparatuses, systems, and methods to move end connectors. In at least one embodiment, a linkage system to move an end connector between at least a first position and a second position is driven by an actuator in a first direction to drive movement of the end connector in a second direction, perpendicular to the first direction.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

The invention relates to a structure (1) for housing electronic apparatuses (10) such as boards (11) and the like, wherein the apparatuses are arranged in a container with a drawer (40) insertable and extractable with respect to a frame (20) of the structure (1). On the back wall of the drawer (40) and on the frame (20) connectors (53, 54) are provided which are coupled directly and automatically when the drawer is inserted.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

A guide module for use with a plug-in module assembly to properly position the plug-in module in a slot of a chassis. The guide module has a leading surface and oppositely facing trailing surface. The guide module has a top wall, a bottom wall, a first inside side wall and an oppositely facing second outside side wall. The leading surface of the guide module extends beyond a leading end of the plug-in module assembly. As the plug-in module is inserted into the chassis, the leading surface of the guide module prevents damage to other components of the plug-in module assembly.

A slot cover and an integrated circuit access device having the slot cover are provided. The slot is used to be removably inserted into a slot of an electronic device and includes a frame, a positioning portion, an engaging portion, and at least one conductive elastic plate. The frame includes a center sheet, a first-side sheet configured to connect to an integrated circuit access module, and a second-side sheet. The first-side sheet and the second-side sheet are respectively located at a first side and a second side of the center sheet. The positioning portion and the engaging portion are respectively located above and below the center sheet. The at least one conductive elastic plate is disposed at the second-side sheet. When the slot cover is inserted in the slot of the electronic device, the center sheet blocks an opening of the slot.