A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.

A rack adapted for receiving a component, a system including the rack and the component and a method of delivering power to the component mounted in the rack are disclosed. The rack comprises a backplane, a power panel, and a main controller. Each stage of the backplane includes a backplane power connector and a backplane data connector that are respectively connectable to a component power connector and to a component data connector when the component is inserted in the backplane stage. The main controller detects an insertion of the component in a given backplane stage by receiving a signal emitted by the backplane data connector of that backplane stage, acquires a set of power parameters of the component, and causes the power panel to provide power to the backplane power connector of that backplane stage according to the set of power parameters of the component.

A base member of the sensor includes a first projection part, a second projection part, and a third projection part, being columnar and projecting from a first placement surface. Tip ends of the first, second and third projection parts are formed on second placement surfaces. The first and second projection parts respectively include a fourth pin and a fifth pin inserted through a second rigid substrate and projecting from the second placement surface. Three ribs are formed on a peripheral surface of the fourth pin and disposed so that positions viewed from a center of the fourth pin respectively form angles less than 180 degrees. Two ribs are formed on a peripheral surface of the fifth pin, and project along a fourth line perpendicular to a third line connecting the fourth pin and the fifth pin.

A network packaging system can include a circuit board that includes a chip located substantially in a center of the board. A backplane is in communication with the chip and located along on a first edge of the circuit board. A plurality of connector ports are arranged along the perimeter of at least two other edges of the circuit board. A plurality of traces connects the plurality of connector ports to the chip. A support structure houses one or more circuit boards, with at least two sidewall surfaces of the support structure extending substantially orthogonal to and coextensive with each of the at least two edges of the circuit board. The support structure includes a plurality of apertures extending through the one or more surfaces spatially aligned with each of the plurality of connector ports.

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

A wall panel system including a first wall panel, the first panel including at least a first panel hook portion. The system also including a second wall panel having a different configuration than the first wall panel. The second panel includes at least a second panel hook portion and a third panel hook portion opposing the second panel hook portion. The first wall panel is configured to engage with the second wall panel to create a wall panel assembly.

A wall panel system including a first wall panel, the first panel including at least a first panel hook portion. The system also including a second wall panel having a different configuration than the first wall panel. The second panel includes at least a second panel hook portion and a third panel hook portion opposing the second panel hook portion. The first wall panel is configured to engage with the second wall panel to create a wall panel assembly.

A wall panel system including a first wall panel, the first panel including at least a first panel hook portion. The system also including a second wall panel having a different configuration than the first wall panel. The second panel includes at least a second panel hook portion and a third panel hook portion opposing the second panel hook portion. The first wall panel is configured to engage with the second wall panel to create a wall panel assembly.

A wall panel system including a first wall panel, the first panel including at least a first panel hook portion. The system also including a second wall panel having a different configuration than the first wall panel. The second panel includes at least a second panel hook portion and a third panel hook portion opposing the second panel hook portion. The first wall panel is configured to engage with the second wall panel to create a wall panel assembly.

Disclosed is a method of assembling a backplane connector subassembly for a module of a modular energy system. The backplane connector subassembly physically and electrically connects at least two modules stacked on top of one another. The method includes providing a back panel defining an inner surface, attaching a first support member to the inner surface of the back panel, attaching a second support member to the inner surface of the back panel, attaching the upstream connector to the back panel by sliding a first mating hole defined in the upstream connector onto the first support member, and attaching the downstream connector to the back panel by a sliding a second mating hole defined in the downstream connector onto the second support member. The first support member is configured to support an upstream connector. The second support member is configured to support a downstream connector.