A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.

A controller includes a control board, a transmitting board, a display board, and a USB board. A modular jack is arranged at a position on one surface of the transmitting board, the surface on which the modular jack is arranged faces the control board, and the position of the modular jack is not covered by the control board. A switch is arranged at a position on one surface of the control board, the surface on which the switch is arranged faces the display board and the USB board, and the position of the switch is not covered by the display board and the USB board.

An industrial controller with a modular backplane includes multiple modules, where each module includes a base and a chassis. Electrical connectors located on each side of the base engage the base of an adjacent module such that the bases are electrically connected. The backplane is defined by and extends through each of the bases connected to each other. A chassis is inserted into each base. Each chassis includes an embedded switch and a local circuit. The embedded switch is in communication with the base, and the local circuit performs the operation of the corresponding module. The embedded switch receives data transmitted along the backplane between bases. The embedded switch reads the data intended for the module and passes the data to the local circuit for further processing. Similarly, the embedded switch receives data from the local circuit and inserts the data on the backplane for transmission to the appropriate module.

A modular and configurable group of electrical device group 10 for measurement, control and display of electrical and process parameters comprising a first sub-group 11 and a second sub-group 12; each member comprises either a neck mountable enclosure unit 22 or a base mountable enclosure unit 21, along with a programmable computing receptacle assembly 390 a plurality of function modules 300, a display module 350 and optionally a battery module 380; wherein, a programming and configuration tool 100 is adopted to program and configure each member as an application specific product 23 or as a programmable device 24; an application specific software concentrate 200 drives each member, and is derived from a code generator 250 which converts a PLC compatible programming language 280 into the application specific software concentrate 200 such that an execution time of a “while loop” of the application specific software concentrate 200 is minimal.

A modular and configurable group of electrical device group 10 for measurement, control and display of electrical and process parameters comprising a first sub-group 11 and a second sub-group 12; each member comprises either a neck mountable enclosure unit 22 or a base mountable enclosure unit 21, along with a programmable computing receptacle assembly 390 a plurality of function modules 300, a display module 350 and optionally a battery module 380; wherein, a programming and configuration tool 100 is adopted to program and configure each member as an application specific product 23 or as a programmable device 24; an application specific software concentrate 200 drives each member, and is derived from a code generator 250 which converts a PLC compatible programming language 280 into the application specific software concentrate 200 such that an execution time of a “while loop” of the application specific software concentrate 200 is minimal.

A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.

A semiconductor device includes a substrate; a first functional circuit attached to the substrate; a first thermal circuit attached to the substrate, configured to utilize cryogenic liquid to cool the first functional circuit; a second functional circuit attached to the substrate; and a second thermal circuit attached to the substrate, configured to cool the second functional circuit without using the cryogenic liquid.

An industrial controller with a modular backplane includes multiple modules, where each module includes a base and a chassis. Electrical connectors located on each side of the base engage the base of an adjacent module such that the bases are electrically connected. The backplane is defined by and extends through each of the bases connected to each other. A chassis is inserted into each base. Each chassis includes an embedded switch and a local circuit. The embedded switch is in communication with the base, and the local circuit performs the operation of the corresponding module. The embedded switch receives data transmitted along the backplane between bases. The embedded switch reads the data intended for the module and passes the data to the local circuit for further processing. Similarly, the embedded switch receives data from the local circuit and inserts the data on the backplane for transmission to the appropriate module.

An industrial controller with a modular backplane includes multiple modules, where each module includes a base and a chassis. Electrical connectors located on each side of the base engage the base of an adjacent module such that the bases are electrically connected. The backplane is defined by and extends through each of the bases connected to each other. A chassis is inserted into each base. Each chassis includes an embedded switch and a local circuit. The embedded switch is in communication with the base, and the local circuit performs the operation of the corresponding module. The embedded switch receives data transmitted along the backplane between bases. The embedded switch reads the data intended for the module and passes the data to the local circuit for further processing. Similarly, the embedded switch receives data from the local circuit and inserts the data on the backplane for transmission to the appropriate module.

A controller includes a control board, a transmitting board, a display board, and a USB board. A modular jack is arranged at a position on one surface of the transmitting board, the surface on which the modular jack is arranged faces the control board, and the position of the modular jack is not covered by the control board. A switch is arranged at a position on one surface of the control board, the surface on which the switch is arranged faces the display board and the USB board, and the position of the switch is not covered by the display board and the USB board.